Investigation Of Wire Sweep During Pbga Encapsulation Process Using Fluid Structure Interaction
The reduction of IC chip size has a significant impact to the modern electronic industry especially on the circuit design and IC assembly process. The increasing of I/O counts in a small scale IC chip result in severe wire deformation and deformation issues during transfer moulding process. In this...
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| Format: | Thesis |
| Language: | English |
| Published: |
2013
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| Online Access: | http://eprints.usm.my/41166/1/Dadan_Ramdan_24_Pages.pdf http://eprints.usm.my/41166/ |
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