Experimental and Numerical Studies of Transient Heat Transfer in Electronics Packaging
Permintaan bagi peranti mudah alih dan tablet adalah tinggi pada setiap masa dalam dekad yang lalu, perhatian yang amat menggalakkan telah ditumpu kepada bidang ini. Sesuatu kajian yang baru diperlukan dalam industri untuk mengiringi permintaan ini adalah untuk menkaji ciri-ciri pemindahan haba se...
Saved in:
Main Author: | Ong Kean Aik, Kean Aik |
---|---|
Format: | Thesis |
Language: | English |
Published: |
2016
|
Subjects: | |
Online Access: | http://eprints.usm.my/40781/1/Experimental_and_Numerical_Studies_of_Transient_Heat_Transfer_in_Electronics_Packaging.pdf http://eprints.usm.my/40781/ |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Experimental And Numerical Studies Of Transient Heat Transfer In Electronics Packaging
by: Ong, Kean Aik
Published: (2017) -
Experimental And Numerical Analysis On The Cooling Performance Of Synthetic Jet At Low Reynolds Number
by: Ho, Roger Zhen Yu
Published: (2018) -
Experimental And Kinetic Study On Co2 Catalytic Gasification Of Biomass Char Using Conventional And Microwave Heating
by: Amiri, Pooya Lahijani
Published: (2014) -
Stress Analysis Of Stretchable Electronic Circuit
by: Aziz, Norhidayah Abdul
Published: (2018) -
Classification of damage severity in natural fibre composites using principal component analysis
by: Mohamad, Zaleha, et al.
Published: (2018)