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Microprocessor Solder Bump Bridging Defects Screening Strategy In Manufacturing Test Flow

Solder bump bridging (SBB) is a type microprocessor packaging defects in Flip-Chip or C4 interconnection layer. The presence of micro conductive contaminate particle in die-package layer which causes bridging between two or more adjacent solder bump. These contaminate particles are mainly comes from...

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Main Author: Loo , Kean Ann
Format: Thesis
Language:English
Published: 2017
Subjects:
TK Electrical Engineering. Electronics. Nuclear Engineering
TK1-9971 Electrical engineering. Electronics. Nuclear engineering
Online Access:http://eprints.usm.my/39584/1/LOO_KEAN_ANN_24_Pages.pdf
http://eprints.usm.my/39584/
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spelling my.usm.eprints.39584 http://eprints.usm.my/39584/ Microprocessor Solder Bump Bridging Defects Screening Strategy In Manufacturing Test Flow Loo , Kean Ann TK Electrical Engineering. Electronics. Nuclear Engineering TK1-9971 Electrical engineering. Electronics. Nuclear engineering Solder bump bridging (SBB) is a type microprocessor packaging defects in Flip-Chip or C4 interconnection layer. The presence of micro conductive contaminate particle in die-package layer which causes bridging between two or more adjacent solder bump. These contaminate particles are mainly comes from solder bump fraction result from deficient packaging process. Today semiconductor manufacturing test flow is still imperfect to completely screen or detect the SBB defect. As bounce back, the test holes contributes to the defect per million (DPM) of the product. In this research, the test holes of SBB defect in High Volume Manufacturing (HVM) will be defined. Meanwhile, SBB defect characterization will be studied where the electrical behavioural of baby bumps is explained. In the final part of the study, an effective SBB screening test at Burn In is developed to minimizing test holes. From the research finding, un-bridging of SBB occurs at extreme high current of 4.5 A where the baby bump burnt and partial unbridged. This unbridged state are unstable and lacking in term of reliability. However, the SBB un-bridging only impacted on Type B SBB defect where baby bump bridging power bump with ground bump. Lastly, the SBB screening test at Burn In stage is developed as part of this research. In conclusion, the proposed test has the potential in minimizing HVM SBB defect test holes by improving SBB defect fault coverage. 2017 Thesis NonPeerReviewed application/pdf en http://eprints.usm.my/39584/1/LOO_KEAN_ANN_24_Pages.pdf Loo , Kean Ann (2017) Microprocessor Solder Bump Bridging Defects Screening Strategy In Manufacturing Test Flow. Masters thesis, Universiti Sains Malaysia.
institution Universiti Sains Malaysia
building Hamzah Sendut Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Sains Malaysia
content_source USM Institutional Repository
url_provider http://eprints.usm.my/
language English
topic TK Electrical Engineering. Electronics. Nuclear Engineering
TK1-9971 Electrical engineering. Electronics. Nuclear engineering
spellingShingle TK Electrical Engineering. Electronics. Nuclear Engineering
TK1-9971 Electrical engineering. Electronics. Nuclear engineering
Loo , Kean Ann
Microprocessor Solder Bump Bridging Defects Screening Strategy In Manufacturing Test Flow
description Solder bump bridging (SBB) is a type microprocessor packaging defects in Flip-Chip or C4 interconnection layer. The presence of micro conductive contaminate particle in die-package layer which causes bridging between two or more adjacent solder bump. These contaminate particles are mainly comes from solder bump fraction result from deficient packaging process. Today semiconductor manufacturing test flow is still imperfect to completely screen or detect the SBB defect. As bounce back, the test holes contributes to the defect per million (DPM) of the product. In this research, the test holes of SBB defect in High Volume Manufacturing (HVM) will be defined. Meanwhile, SBB defect characterization will be studied where the electrical behavioural of baby bumps is explained. In the final part of the study, an effective SBB screening test at Burn In is developed to minimizing test holes. From the research finding, un-bridging of SBB occurs at extreme high current of 4.5 A where the baby bump burnt and partial unbridged. This unbridged state are unstable and lacking in term of reliability. However, the SBB un-bridging only impacted on Type B SBB defect where baby bump bridging power bump with ground bump. Lastly, the SBB screening test at Burn In stage is developed as part of this research. In conclusion, the proposed test has the potential in minimizing HVM SBB defect test holes by improving SBB defect fault coverage.
format Thesis
author Loo , Kean Ann
author_facet Loo , Kean Ann
author_sort Loo , Kean Ann
title Microprocessor Solder Bump Bridging Defects Screening Strategy In Manufacturing Test Flow
title_short Microprocessor Solder Bump Bridging Defects Screening Strategy In Manufacturing Test Flow
title_full Microprocessor Solder Bump Bridging Defects Screening Strategy In Manufacturing Test Flow
title_fullStr Microprocessor Solder Bump Bridging Defects Screening Strategy In Manufacturing Test Flow
title_full_unstemmed Microprocessor Solder Bump Bridging Defects Screening Strategy In Manufacturing Test Flow
title_sort microprocessor solder bump bridging defects screening strategy in manufacturing test flow
publishDate 2017
url http://eprints.usm.my/39584/1/LOO_KEAN_ANN_24_Pages.pdf
http://eprints.usm.my/39584/
_version_ 1643709693760110592
score 13.211869

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