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Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process

This paper presents the investigation of the effects of epoxy moulding compound’ (EMC) viscosity on the FSI aspects during moulded underfill process (MUF). Finite volume (FV) code and finite element (FE) code were connected online through the Mesh-based Parallel Code Coupling Interface (MpCCI) m...

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Main Authors:	Khor, C.Y., Ishak, Muhammad Ikman, Rosli, M.U., Jamalludin, Mohd Riduan, Zakaria, M.S, Yamin, A.F.M., Abdul Aziz, M.S., Abdullah, M.Z.
Format:	Article
Language:	English
Published:	EDP Sciences 2017
Subjects:	TJ1-1570 Mechanical engineering and machinery TL1-4050 Motor vehicles. Aeronautics. Astronautics
Online Access:	http://eprints.usm.my/37007/1/%28Influence_of_Material_Properties%29_matecconf_etic2017_01059.pdf http://eprints.usm.my/37007/ https://doi.org/10.1051/matecconf/20179701059
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spelling	my.usm.eprints.37007 http://eprints.usm.my/37007/ Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process Khor, C.Y. Ishak, Muhammad Ikman Rosli, M.U. Jamalludin, Mohd Riduan Zakaria, M.S Yamin, A.F.M. Abdul Aziz, M.S. Abdullah, M.Z. TJ1-1570 Mechanical engineering and machinery TL1-4050 Motor vehicles. Aeronautics. Astronautics This paper presents the investigation of the effects of epoxy moulding compound’ (EMC) viscosity on the FSI aspects during moulded underfill process (MUF). Finite volume (FV) code and finite element (FE) code were connected online through the Mesh-based Parallel Code Coupling Interface (MpCCI) method for fluid and structural analysis. The EMC flow behaviour was modelled by Castro-Macosko model, which was written in C language and incorporated into the FV analysis. Real-time predictions on the flow front, chip deformation and stress concentration were solved by FV- and FE-solver. Increase in EMC viscosity raises the deformation and stress imposed on IC and solder bump, which may induce unintended features on the IC structure. The current simulation is expected to provide the better understandings and clear visualization of FSI in the moulded underfill process. EDP Sciences 2017 Article PeerReviewed application/pdf en http://eprints.usm.my/37007/1/%28Influence_of_Material_Properties%29_matecconf_etic2017_01059.pdf Khor, C.Y. and Ishak, Muhammad Ikman and Rosli, M.U. and Jamalludin, Mohd Riduan and Zakaria, M.S and Yamin, A.F.M. and Abdul Aziz, M.S. and Abdullah, M.Z. (2017) Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process. MATEC Web of Conferences, 97 ( 01059). pp. 1-6. ISSN 2261-236X https://doi.org/10.1051/matecconf/20179701059
institution	Universiti Sains Malaysia
building	Hamzah Sendut Library
collection	Institutional Repository
continent	Asia
country	Malaysia
content_provider	Universiti Sains Malaysia
content_source	USM Institutional Repository
url_provider	http://eprints.usm.my/
language	English
topic	TJ1-1570 Mechanical engineering and machinery TL1-4050 Motor vehicles. Aeronautics. Astronautics
spellingShingle	TJ1-1570 Mechanical engineering and machinery TL1-4050 Motor vehicles. Aeronautics. Astronautics Khor, C.Y. Ishak, Muhammad Ikman Rosli, M.U. Jamalludin, Mohd Riduan Zakaria, M.S Yamin, A.F.M. Abdul Aziz, M.S. Abdullah, M.Z. Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process
description	This paper presents the investigation of the effects of epoxy moulding compound’ (EMC) viscosity on the FSI aspects during moulded underfill process (MUF). Finite volume (FV) code and finite element (FE) code were connected online through the Mesh-based Parallel Code Coupling Interface (MpCCI) method for fluid and structural analysis. The EMC flow behaviour was modelled by Castro-Macosko model, which was written in C language and incorporated into the FV analysis. Real-time predictions on the flow front, chip deformation and stress concentration were solved by FV- and FE-solver. Increase in EMC viscosity raises the deformation and stress imposed on IC and solder bump, which may induce unintended features on the IC structure. The current simulation is expected to provide the better understandings and clear visualization of FSI in the moulded underfill process.
format	Article
author	Khor, C.Y. Ishak, Muhammad Ikman Rosli, M.U. Jamalludin, Mohd Riduan Zakaria, M.S Yamin, A.F.M. Abdul Aziz, M.S. Abdullah, M.Z.
author_facet	Khor, C.Y. Ishak, Muhammad Ikman Rosli, M.U. Jamalludin, Mohd Riduan Zakaria, M.S Yamin, A.F.M. Abdul Aziz, M.S. Abdullah, M.Z.
author_sort	Khor, C.Y.
title	Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process
title_short	Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process
title_full	Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process
title_fullStr	Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process
title_full_unstemmed	Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process
title_sort	influence of material properties on the fluid-structure interaction aspects during molded underfill process
publisher	EDP Sciences
publishDate	2017
url	http://eprints.usm.my/37007/1/%28Influence_of_Material_Properties%29_matecconf_etic2017_01059.pdf http://eprints.usm.my/37007/ https://doi.org/10.1051/matecconf/20179701059
_version_	1643708947264176128
score	13.223943

Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process

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