Cover Image

Effect Of Al Addition To Imc Formation, Mechanical And Wetting Properties Of Low-Ag Sac Solder Alloy

The effect of various percentages of Al addition to the microstructure of bulk, intermetallic compound (IMC) formation, wetting properties and mechanical properties of Sn-0.3Ag-0.5Cu (SAC0305) solder alloy was investigated. SAC0305, SAC-0.5Al, SAC-1Al, SAC-1.5Al and SAC-2Al were prepared via casting...

Full description

Saved in:
Bibliographic Details
Main Author: Kamarudin, Maslina
Format: Thesis
Language:English
Published: 2015
Subjects:
TA404 Composite materials
Online Access:http://eprints.usm.my/36878/1/MASLINDA_BINTI_KAMARUDIN_24_Pages.pdf
http://eprints.usm.my/36878/
Tags: Add Tag
No Tags, Be the first to tag this record!
id my.usm.eprints.36878
record_format eprints
spelling my.usm.eprints.36878 http://eprints.usm.my/36878/ Effect Of Al Addition To Imc Formation, Mechanical And Wetting Properties Of Low-Ag Sac Solder Alloy Kamarudin, Maslina TA404 Composite materials The effect of various percentages of Al addition to the microstructure of bulk, intermetallic compound (IMC) formation, wetting properties and mechanical properties of Sn-0.3Ag-0.5Cu (SAC0305) solder alloy was investigated. SAC0305, SAC-0.5Al, SAC-1Al, SAC-1.5Al and SAC-2Al were prepared via casting process. The solder alloys were reflowed onto Cu substrate at 260 ºC for 10 seconds. The composition of each solder alloys were determined using XRF. DSC was used to evaluate the thermal characteristics while wetting balance test and spreading test were used to analyze the wettability. The microstructures of the bulk solder as well as the interfacial IMC layer were observed using SEM equipped with EDX. Meanwhile, ball shear test was carried out to assess the reliability of the solder joints. The wettability of solder alloys decreased with the increasing amount of Al, but still within the acceptable range. Addition of Al resulted in the formation of Ag3Al and Cu-Al IMC, lowered the amount of Ag3Sn and Cu6Sn5 IMC and refined β-Sn dendrites. Further addition of Al above 1 wt.% resulted in the formation of primary Al particles. The amount of Ag3Al and Cu-Al IMC and primary Al particles increased with increasing amount of Al. The Al-added solder alloys gave thinner IMC layer (0.62 μm to 1.15 μm) at the solder joint compared to SAC0305 (2.39 μm) for as reflowed conditions and also after isothermal aging. The shear strength of Al added solder alloys which ranging from 21.93 MPa to 19.96 MPa were higher than SAC0305 (19.21 MPa) but lower than SAC305 (35 MPa). SAC-1Al was found to be the xxiii best solder alloy compared to the other four due to its fine microstructure, thin IMC layer, acceptable wetting and high shear strength. 2015 Thesis NonPeerReviewed application/pdf en http://eprints.usm.my/36878/1/MASLINDA_BINTI_KAMARUDIN_24_Pages.pdf Kamarudin, Maslina (2015) Effect Of Al Addition To Imc Formation, Mechanical And Wetting Properties Of Low-Ag Sac Solder Alloy. Masters thesis, Universiti Sains Malaysia.
institution Universiti Sains Malaysia
building Hamzah Sendut Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Sains Malaysia
content_source USM Institutional Repository
url_provider http://eprints.usm.my/
language English
topic TA404 Composite materials
spellingShingle TA404 Composite materials
Kamarudin, Maslina
Effect Of Al Addition To Imc Formation, Mechanical And Wetting Properties Of Low-Ag Sac Solder Alloy
description The effect of various percentages of Al addition to the microstructure of bulk, intermetallic compound (IMC) formation, wetting properties and mechanical properties of Sn-0.3Ag-0.5Cu (SAC0305) solder alloy was investigated. SAC0305, SAC-0.5Al, SAC-1Al, SAC-1.5Al and SAC-2Al were prepared via casting process. The solder alloys were reflowed onto Cu substrate at 260 ºC for 10 seconds. The composition of each solder alloys were determined using XRF. DSC was used to evaluate the thermal characteristics while wetting balance test and spreading test were used to analyze the wettability. The microstructures of the bulk solder as well as the interfacial IMC layer were observed using SEM equipped with EDX. Meanwhile, ball shear test was carried out to assess the reliability of the solder joints. The wettability of solder alloys decreased with the increasing amount of Al, but still within the acceptable range. Addition of Al resulted in the formation of Ag3Al and Cu-Al IMC, lowered the amount of Ag3Sn and Cu6Sn5 IMC and refined β-Sn dendrites. Further addition of Al above 1 wt.% resulted in the formation of primary Al particles. The amount of Ag3Al and Cu-Al IMC and primary Al particles increased with increasing amount of Al. The Al-added solder alloys gave thinner IMC layer (0.62 μm to 1.15 μm) at the solder joint compared to SAC0305 (2.39 μm) for as reflowed conditions and also after isothermal aging. The shear strength of Al added solder alloys which ranging from 21.93 MPa to 19.96 MPa were higher than SAC0305 (19.21 MPa) but lower than SAC305 (35 MPa). SAC-1Al was found to be the xxiii best solder alloy compared to the other four due to its fine microstructure, thin IMC layer, acceptable wetting and high shear strength.
format Thesis
author Kamarudin, Maslina
author_facet Kamarudin, Maslina
author_sort Kamarudin, Maslina
title Effect Of Al Addition To Imc Formation, Mechanical And Wetting Properties Of Low-Ag Sac Solder Alloy
title_short Effect Of Al Addition To Imc Formation, Mechanical And Wetting Properties Of Low-Ag Sac Solder Alloy
title_full Effect Of Al Addition To Imc Formation, Mechanical And Wetting Properties Of Low-Ag Sac Solder Alloy
title_fullStr Effect Of Al Addition To Imc Formation, Mechanical And Wetting Properties Of Low-Ag Sac Solder Alloy
title_full_unstemmed Effect Of Al Addition To Imc Formation, Mechanical And Wetting Properties Of Low-Ag Sac Solder Alloy
title_sort effect of al addition to imc formation, mechanical and wetting properties of low-ag sac solder alloy
publishDate 2015
url http://eprints.usm.my/36878/1/MASLINDA_BINTI_KAMARUDIN_24_Pages.pdf
http://eprints.usm.my/36878/
_version_ 1643708910556676096
score 13.211869

Similar Items