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Solder Joint Reliability Of Flip Chip BGA Package

Daya tahan hubungan bebola pateri merupakan satu kriteria keboleharapan yang penting dalam pempakejan elektronik moden. The integrity of ball and bump solder joints is a major reliability concern in modern micro electronic packages.

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Bibliographic Details
Main Author: Lee, Kor Oon
Format: Thesis
Language:English
Published: 2004
Subjects:
TA1-2040 Engineering (General). Civil engineering (General)
Online Access:http://eprints.usm.my/3572/1/Solder_Joint_Reliability_Of_Flip_Chip_BGA_Package-Lee_Kor_Oon-PPKM.pdf
http://eprints.usm.my/3572/
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spelling my.usm.eprints.3572 http://eprints.usm.my/3572/ Solder Joint Reliability Of Flip Chip BGA Package Lee, Kor Oon TA1-2040 Engineering (General). Civil engineering (General) Daya tahan hubungan bebola pateri merupakan satu kriteria keboleharapan yang penting dalam pempakejan elektronik moden. The integrity of ball and bump solder joints is a major reliability concern in modern micro electronic packages. 2004-03 Thesis NonPeerReviewed application/pdf en http://eprints.usm.my/3572/1/Solder_Joint_Reliability_Of_Flip_Chip_BGA_Package-Lee_Kor_Oon-PPKM.pdf Lee, Kor Oon (2004) Solder Joint Reliability Of Flip Chip BGA Package. Masters thesis, Universiti Sains Malaysia.
institution Universiti Sains Malaysia
building Hamzah Sendut Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Sains Malaysia
content_source USM Institutional Repository
url_provider http://eprints.usm.my/
language English
topic TA1-2040 Engineering (General). Civil engineering (General)
spellingShingle TA1-2040 Engineering (General). Civil engineering (General)
Lee, Kor Oon
Solder Joint Reliability Of Flip Chip BGA Package
description Daya tahan hubungan bebola pateri merupakan satu kriteria keboleharapan yang penting dalam pempakejan elektronik moden. The integrity of ball and bump solder joints is a major reliability concern in modern micro electronic packages.
format Thesis
author Lee, Kor Oon
author_facet Lee, Kor Oon
author_sort Lee, Kor Oon
title Solder Joint Reliability Of Flip Chip BGA Package
title_short Solder Joint Reliability Of Flip Chip BGA Package
title_full Solder Joint Reliability Of Flip Chip BGA Package
title_fullStr Solder Joint Reliability Of Flip Chip BGA Package
title_full_unstemmed Solder Joint Reliability Of Flip Chip BGA Package
title_sort solder joint reliability of flip chip bga package
publishDate 2004
url http://eprints.usm.my/3572/1/Solder_Joint_Reliability_Of_Flip_Chip_BGA_Package-Lee_Kor_Oon-PPKM.pdf
http://eprints.usm.my/3572/
_version_ 1643699650096529408
score 13.211869

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