Heat Pipes In Electronic Packaging
Industri electronik berkembang ke arah qualiti dan kelajuan computational yang tinggi. The electronic industry is developing towards higher quality and computational speed. It has led to the increase in chip heat fluxes.
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Format: | Thesis |
Language: | English |
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2006
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Online Access: | http://eprints.usm.my/29322/1/Heat_pipes_in_electronic_packaging.pdf http://eprints.usm.my/29322/ |
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my.usm.eprints.29322 http://eprints.usm.my/29322/ Heat Pipes In Electronic Packaging Munusamy, Sri Jaiandran Q Science Industri electronik berkembang ke arah qualiti dan kelajuan computational yang tinggi. The electronic industry is developing towards higher quality and computational speed. It has led to the increase in chip heat fluxes. 2006-01 Thesis NonPeerReviewed application/pdf en http://eprints.usm.my/29322/1/Heat_pipes_in_electronic_packaging.pdf Munusamy, Sri Jaiandran (2006) Heat Pipes In Electronic Packaging. Masters thesis, USM . |
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Universiti Sains Malaysia |
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Hamzah Sendut Library |
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Universiti Sains Malaysia |
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http://eprints.usm.my/ |
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English |
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Q Science Munusamy, Sri Jaiandran Heat Pipes In Electronic Packaging |
description |
Industri electronik berkembang ke arah qualiti dan kelajuan
computational yang tinggi.
The electronic industry is developing towards higher quality and computational speed. It has led to the increase in chip heat fluxes. |
format |
Thesis |
author |
Munusamy, Sri Jaiandran |
author_facet |
Munusamy, Sri Jaiandran |
author_sort |
Munusamy, Sri Jaiandran |
title |
Heat Pipes In Electronic Packaging |
title_short |
Heat Pipes In Electronic Packaging |
title_full |
Heat Pipes In Electronic Packaging |
title_fullStr |
Heat Pipes In Electronic Packaging |
title_full_unstemmed |
Heat Pipes In Electronic Packaging |
title_sort |
heat pipes in electronic packaging |
publishDate |
2006 |
url |
http://eprints.usm.my/29322/1/Heat_pipes_in_electronic_packaging.pdf http://eprints.usm.my/29322/ |
_version_ |
1643706871199039488 |
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13.211869 |