Heat Pipes In Electronic Packaging

Industri electronik berkembang ke arah qualiti dan kelajuan computational yang tinggi. The electronic industry is developing towards higher quality and computational speed. It has led to the increase in chip heat fluxes.

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Bibliographic Details
Main Author: Munusamy, Sri Jaiandran
Format: Thesis
Language:English
Published: 2006
Subjects:
Online Access:http://eprints.usm.my/29322/1/Heat_pipes_in_electronic_packaging.pdf
http://eprints.usm.my/29322/
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spelling my.usm.eprints.29322 http://eprints.usm.my/29322/ Heat Pipes In Electronic Packaging Munusamy, Sri Jaiandran Q Science Industri electronik berkembang ke arah qualiti dan kelajuan computational yang tinggi. The electronic industry is developing towards higher quality and computational speed. It has led to the increase in chip heat fluxes. 2006-01 Thesis NonPeerReviewed application/pdf en http://eprints.usm.my/29322/1/Heat_pipes_in_electronic_packaging.pdf Munusamy, Sri Jaiandran (2006) Heat Pipes In Electronic Packaging. Masters thesis, USM .
institution Universiti Sains Malaysia
building Hamzah Sendut Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Sains Malaysia
content_source USM Institutional Repository
url_provider http://eprints.usm.my/
language English
topic Q Science
spellingShingle Q Science
Munusamy, Sri Jaiandran
Heat Pipes In Electronic Packaging
description Industri electronik berkembang ke arah qualiti dan kelajuan computational yang tinggi. The electronic industry is developing towards higher quality and computational speed. It has led to the increase in chip heat fluxes.
format Thesis
author Munusamy, Sri Jaiandran
author_facet Munusamy, Sri Jaiandran
author_sort Munusamy, Sri Jaiandran
title Heat Pipes In Electronic Packaging
title_short Heat Pipes In Electronic Packaging
title_full Heat Pipes In Electronic Packaging
title_fullStr Heat Pipes In Electronic Packaging
title_full_unstemmed Heat Pipes In Electronic Packaging
title_sort heat pipes in electronic packaging
publishDate 2006
url http://eprints.usm.my/29322/1/Heat_pipes_in_electronic_packaging.pdf
http://eprints.usm.my/29322/
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score 13.211869