Properties Of Epoxy/Silica Thin Film Composite For Electronic Application.
In line with the miniaturization trends of the product designs in electronic industry, conventional packaging technology has been replaced.
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| Main Authors: | , , , |
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| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
2010
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| Subjects: | |
| Online Access: | http://eprints.usm.my/20364/1/TUE-SE08-05.pdf http://eprints.usm.my/20364/ |
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