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The Influence Of Gallium Addition On The Properties Of Sn3.0Ag0.5Cu Lead Free Solder [TD799.85. F146 2008 f rb].

Kajian ini menekankan ke atas kesan penambahan gallium (Ga) ke atas sifatsifat fizikal, mekanikal dan metalurgi bagi pateri bebas plumbum Sn3.0Ag0.5Cu (berdasarkan peratus berat). The work focused on the effect of Gallium (Ga) additions on the physical, mechanical and metallurgical properties of...

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Main Author: Zakaria, Mohamad Fadley
Format: Thesis
Language:English
Published: 2008
Subjects:
TD783-812.5 Municipal refuse. Solid wastes
Online Access:http://eprints.usm.my/10393/1/THE_INFLUENCE_OF_GALLIUM_ADDITION_ON_THE_PROPERTIES_OF.pdf
http://eprints.usm.my/10393/
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spelling my.usm.eprints.10393 http://eprints.usm.my/10393/ The Influence Of Gallium Addition On The Properties Of Sn3.0Ag0.5Cu Lead Free Solder [TD799.85. F146 2008 f rb]. Zakaria, Mohamad Fadley TD783-812.5 Municipal refuse. Solid wastes Kajian ini menekankan ke atas kesan penambahan gallium (Ga) ke atas sifatsifat fizikal, mekanikal dan metalurgi bagi pateri bebas plumbum Sn3.0Ag0.5Cu (berdasarkan peratus berat). The work focused on the effect of Gallium (Ga) additions on the physical, mechanical and metallurgical properties of Sn3.0Ag0.5Cu lead free solder (by the weight percentage). 2008-08 Thesis NonPeerReviewed application/pdf en http://eprints.usm.my/10393/1/THE_INFLUENCE_OF_GALLIUM_ADDITION_ON_THE_PROPERTIES_OF.pdf Zakaria, Mohamad Fadley (2008) The Influence Of Gallium Addition On The Properties Of Sn3.0Ag0.5Cu Lead Free Solder [TD799.85. F146 2008 f rb]. Masters thesis, Universiti Sains Malaysia.
institution Universiti Sains Malaysia
building Hamzah Sendut Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Sains Malaysia
content_source USM Institutional Repository
url_provider http://eprints.usm.my/
language English
topic TD783-812.5 Municipal refuse. Solid wastes
spellingShingle TD783-812.5 Municipal refuse. Solid wastes
Zakaria, Mohamad Fadley
The Influence Of Gallium Addition On The Properties Of Sn3.0Ag0.5Cu Lead Free Solder [TD799.85. F146 2008 f rb].
description Kajian ini menekankan ke atas kesan penambahan gallium (Ga) ke atas sifatsifat fizikal, mekanikal dan metalurgi bagi pateri bebas plumbum Sn3.0Ag0.5Cu (berdasarkan peratus berat). The work focused on the effect of Gallium (Ga) additions on the physical, mechanical and metallurgical properties of Sn3.0Ag0.5Cu lead free solder (by the weight percentage).
format Thesis
author Zakaria, Mohamad Fadley
author_facet Zakaria, Mohamad Fadley
author_sort Zakaria, Mohamad Fadley
title The Influence Of Gallium Addition On The Properties Of Sn3.0Ag0.5Cu Lead Free Solder [TD799.85. F146 2008 f rb].
title_short The Influence Of Gallium Addition On The Properties Of Sn3.0Ag0.5Cu Lead Free Solder [TD799.85. F146 2008 f rb].
title_full The Influence Of Gallium Addition On The Properties Of Sn3.0Ag0.5Cu Lead Free Solder [TD799.85. F146 2008 f rb].
title_fullStr The Influence Of Gallium Addition On The Properties Of Sn3.0Ag0.5Cu Lead Free Solder [TD799.85. F146 2008 f rb].
title_full_unstemmed The Influence Of Gallium Addition On The Properties Of Sn3.0Ag0.5Cu Lead Free Solder [TD799.85. F146 2008 f rb].
title_sort influence of gallium addition on the properties of sn3.0ag0.5cu lead free solder [td799.85. f146 2008 f rb].
publishDate 2008
url http://eprints.usm.my/10393/1/THE_INFLUENCE_OF_GALLIUM_ADDITION_ON_THE_PROPERTIES_OF.pdf
http://eprints.usm.my/10393/
_version_ 1643701526778085376
score 13.211869

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