Minimization of copper dissolution for lead-free wave soldering in surface mount technology
In today’s surface mount technology, developments are in progress to move towards green manufacturing by converting all leaded soldering process to lead free soldering process. This move has brought towards safer electronic manufacturing and assembly. The conversion has brought goodness for envi...
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| Format: | Thesis |
| Language: | English |
| Published: |
2017
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| Online Access: | http://psasir.upm.edu.my/id/eprint/98188/1/FK%202020%2090%20-%20IR.pdf http://psasir.upm.edu.my/id/eprint/98188/ |
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