Microstructural and shear strength properties of GNSs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish
In this study, the combined effect of GNSs (graphene nanosheets) and ENIAg (Electroless Nickel Immersion Silver) surface finish on the formation of intermetallic compounds (IMCs) and shear strength of the Sn-1.0Ag-0.5Cu (SAC105) solder system was studied. Both plain and composite solder systems (SAC...
Saved in:
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Published: |
Elsevier
2021
|
| Online Access: | http://psasir.upm.edu.my/id/eprint/94189/ https://www.sciencedirect.com/science/article/pii/S2238785421010486 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Be the first to leave a comment!