Potential enhancement in mechanical and physical properties of Sn-Ag-Cu lead free solder as a replacement material for Sn-Pb in electronic packaging
Sn-Ag-Cu lead free solder is a well-known studied material replacing the Sn-Pb solder which is prohibited due to the toxicity of lead. Even though it is proven to have good reliability and mechanical properties, Sn-Ag-Cu is lacking in terms of melting point and wettability. Previously, research has...
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| Main Authors: | , , , |
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| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
2015
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| Online Access: | http://psasir.upm.edu.my/id/eprint/66184/1/Potential%20enhancement%20in%20mechanical%20and%20physical%20properties%20of%20Sn-Ag-Cu%20lead%20free%20solder%20as%20a%20replacement%20material%20for%20Sn-Pb%20in%20electronic%20packaging.pdf http://psasir.upm.edu.my/id/eprint/66184/ |
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