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Intermetallic growth of SAC237 solder paste reinforced with 0.01wt.% multi-walled carbon nanotubes

The formation of intermetallic compound (IMC) layer at the interfaces of pad finishes have been studied. The growth of IMC layer after as reflow process and its properties were also discussed. In this study, solder alloy SAC237 (Sn: 99 wt.%, Ag: 0.3 wt.%, Cu: 0.7 wt.%) reinforced with 0.01 wt.% Mult...

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Main Authors: Mohd Najib, Mohamad Aznan, Mohamed Ariff, Azmah Hanim, Roslan, Muhammad Raimi, Anuar, Muhammad Azrol Amin
Format: Conference or Workshop Item
Language:English
Published: 2015
Online Access:http://psasir.upm.edu.my/id/eprint/66182/1/Intermetallic%20growth%20of%20SAC237%20solder%20paste%20reinforced%20with%200.01wt.%25%20multi-walled%20carbon%20nanotubes.pdf
http://psasir.upm.edu.my/id/eprint/66182/
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spelling my.upm.eprints.661822019-02-12T06:46:20Z http://psasir.upm.edu.my/id/eprint/66182/ Intermetallic growth of SAC237 solder paste reinforced with 0.01wt.% multi-walled carbon nanotubes Mohd Najib, Mohamad Aznan Mohamed Ariff, Azmah Hanim Roslan, Muhammad Raimi Anuar, Muhammad Azrol Amin The formation of intermetallic compound (IMC) layer at the interfaces of pad finishes have been studied. The growth of IMC layer after as reflow process and its properties were also discussed. In this study, solder alloy SAC237 (Sn: 99 wt.%, Ag: 0.3 wt.%, Cu: 0.7 wt.%) reinforced with 0.01 wt.% Multi-Walled Carbon Nanotubes (MWCNTs) was mixed to form a composite solder paste and soldered on Electroless Nickel Immersion Gold (ENIG) and Immersion Tin (ImSn) pad finishes. Reflow process was conducted in oven with specific reflow profile. The growth and properties of IMC layer were analysed using optical microscope with image analyzer. Results show that the thickness of IMC layer for ENIG and ImSn were 1.49 µm and 2.51 µm respectively. Floating IMC and voids within the solder bulk and IMC layer were also identified in the samples. In addition, the measured wetting angle for ENIG and ImSn were 16.21° and 34.32°. 2015 Conference or Workshop Item PeerReviewed text en http://psasir.upm.edu.my/id/eprint/66182/1/Intermetallic%20growth%20of%20SAC237%20solder%20paste%20reinforced%20with%200.01wt.%25%20multi-walled%20carbon%20nanotubes.pdf Mohd Najib, Mohamad Aznan and Mohamed Ariff, Azmah Hanim and Roslan, Muhammad Raimi and Anuar, Muhammad Azrol Amin (2015) Intermetallic growth of SAC237 solder paste reinforced with 0.01wt.% multi-walled carbon nanotubes. In: INTROP Research Colloquim 2015, 1-2 Dec. 2015, RHR Hotel, Uniten, Putrajaya. .
institution Universiti Putra Malaysia
building UPM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Putra Malaysia
content_source UPM Institutional Repository
url_provider http://psasir.upm.edu.my/
language English
description The formation of intermetallic compound (IMC) layer at the interfaces of pad finishes have been studied. The growth of IMC layer after as reflow process and its properties were also discussed. In this study, solder alloy SAC237 (Sn: 99 wt.%, Ag: 0.3 wt.%, Cu: 0.7 wt.%) reinforced with 0.01 wt.% Multi-Walled Carbon Nanotubes (MWCNTs) was mixed to form a composite solder paste and soldered on Electroless Nickel Immersion Gold (ENIG) and Immersion Tin (ImSn) pad finishes. Reflow process was conducted in oven with specific reflow profile. The growth and properties of IMC layer were analysed using optical microscope with image analyzer. Results show that the thickness of IMC layer for ENIG and ImSn were 1.49 µm and 2.51 µm respectively. Floating IMC and voids within the solder bulk and IMC layer were also identified in the samples. In addition, the measured wetting angle for ENIG and ImSn were 16.21° and 34.32°.
format Conference or Workshop Item
author Mohd Najib, Mohamad Aznan
Mohamed Ariff, Azmah Hanim
Roslan, Muhammad Raimi
Anuar, Muhammad Azrol Amin
spellingShingle Mohd Najib, Mohamad Aznan
Mohamed Ariff, Azmah Hanim
Roslan, Muhammad Raimi
Anuar, Muhammad Azrol Amin
Intermetallic growth of SAC237 solder paste reinforced with 0.01wt.% multi-walled carbon nanotubes
author_facet Mohd Najib, Mohamad Aznan
Mohamed Ariff, Azmah Hanim
Roslan, Muhammad Raimi
Anuar, Muhammad Azrol Amin
author_sort Mohd Najib, Mohamad Aznan
title Intermetallic growth of SAC237 solder paste reinforced with 0.01wt.% multi-walled carbon nanotubes
title_short Intermetallic growth of SAC237 solder paste reinforced with 0.01wt.% multi-walled carbon nanotubes
title_full Intermetallic growth of SAC237 solder paste reinforced with 0.01wt.% multi-walled carbon nanotubes
title_fullStr Intermetallic growth of SAC237 solder paste reinforced with 0.01wt.% multi-walled carbon nanotubes
title_full_unstemmed Intermetallic growth of SAC237 solder paste reinforced with 0.01wt.% multi-walled carbon nanotubes
title_sort intermetallic growth of sac237 solder paste reinforced with 0.01wt.% multi-walled carbon nanotubes
publishDate 2015
url http://psasir.upm.edu.my/id/eprint/66182/1/Intermetallic%20growth%20of%20SAC237%20solder%20paste%20reinforced%20with%200.01wt.%25%20multi-walled%20carbon%20nanotubes.pdf
http://psasir.upm.edu.my/id/eprint/66182/
_version_ 1643838529204125696
score 13.211869

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