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Microstructural evaluation of Bi-Ag and Bi-Sb lead-free high-temperature solder candidates on copper substrate with multiple reflow number

An impetus has been provided towards the development of lead-free solders by worldwide environmental legislation that banned the use of lead in solders due to the lead toxicity. This study focus on Bi-Ag and Bi-Sb solder alloys, in compositions from 1.5 to 5 wt % Ag and Sb. The effects of Ag and Sb...

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Main Authors: Nahavandi, Mahdi, Mohamed Ariff, Azmah Hanim, Zahari, Nur Ismarrubie, Baserfalak, F.
Format: Article
Language:English
Published: Trans Tech Publications 2014
Online Access:http://psasir.upm.edu.my/id/eprint/34519/1/Microstructural%20evaluation%20of%20Bi-Ag%20and%20Bi-Sb%20lead-free%20high-temperature%20solder%20candidates%20on%20copper%20substrate%20with%20multiple%20reflow%20number.pdf
http://psasir.upm.edu.my/id/eprint/34519/
http://www.scientific.net/AMM.564.388
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spelling my.upm.eprints.345192016-09-19T03:17:41Z http://psasir.upm.edu.my/id/eprint/34519/ Microstructural evaluation of Bi-Ag and Bi-Sb lead-free high-temperature solder candidates on copper substrate with multiple reflow number Nahavandi, Mahdi Mohamed Ariff, Azmah Hanim Zahari, Nur Ismarrubie Baserfalak, F. An impetus has been provided towards the development of lead-free solders by worldwide environmental legislation that banned the use of lead in solders due to the lead toxicity. This study focus on Bi-Ag and Bi-Sb solder alloys, in compositions from 1.5 to 5 wt % Ag and Sb. The effects of Ag and Sb amount, and reflow number on the microstructure and morphology of solder bulk were analysed by optical microscope and scanning electron microscope-energy dispersive X-ray. Based on the results, the grain boundary grooving was observed in all samples except Bi-5Sb in all three reflows. Metallurgical and chemical reaction between interface and solders were found in Bi-5Sb solder alloys in different reflow numbers which lead to appearance of Cu3Sb intermetallic compound layer at the interface. Reflow numbers had a significant effect on the size of Cu-rich phase. Also it was observed that, with increasing reflow number Bi-Cu phase found in Bi-2.5Sb solder dissolves into the solder bulk. Trans Tech Publications 2014 Article PeerReviewed application/pdf en http://psasir.upm.edu.my/id/eprint/34519/1/Microstructural%20evaluation%20of%20Bi-Ag%20and%20Bi-Sb%20lead-free%20high-temperature%20solder%20candidates%20on%20copper%20substrate%20with%20multiple%20reflow%20number.pdf Nahavandi, Mahdi and Mohamed Ariff, Azmah Hanim and Zahari, Nur Ismarrubie and Baserfalak, F. (2014) Microstructural evaluation of Bi-Ag and Bi-Sb lead-free high-temperature solder candidates on copper substrate with multiple reflow number. Applied Mechanics and Materials, 564. pp. 388-393. ISSN 1660-9336; ESSN: 1662-7482 http://www.scientific.net/AMM.564.388 10.4028/www.scientific.net/AMM.564.388
institution Universiti Putra Malaysia
building UPM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Putra Malaysia
content_source UPM Institutional Repository
url_provider http://psasir.upm.edu.my/
language English
description An impetus has been provided towards the development of lead-free solders by worldwide environmental legislation that banned the use of lead in solders due to the lead toxicity. This study focus on Bi-Ag and Bi-Sb solder alloys, in compositions from 1.5 to 5 wt % Ag and Sb. The effects of Ag and Sb amount, and reflow number on the microstructure and morphology of solder bulk were analysed by optical microscope and scanning electron microscope-energy dispersive X-ray. Based on the results, the grain boundary grooving was observed in all samples except Bi-5Sb in all three reflows. Metallurgical and chemical reaction between interface and solders were found in Bi-5Sb solder alloys in different reflow numbers which lead to appearance of Cu3Sb intermetallic compound layer at the interface. Reflow numbers had a significant effect on the size of Cu-rich phase. Also it was observed that, with increasing reflow number Bi-Cu phase found in Bi-2.5Sb solder dissolves into the solder bulk.
format Article
author Nahavandi, Mahdi
Mohamed Ariff, Azmah Hanim
Zahari, Nur Ismarrubie
Baserfalak, F.
spellingShingle Nahavandi, Mahdi
Mohamed Ariff, Azmah Hanim
Zahari, Nur Ismarrubie
Baserfalak, F.
Microstructural evaluation of Bi-Ag and Bi-Sb lead-free high-temperature solder candidates on copper substrate with multiple reflow number
author_facet Nahavandi, Mahdi
Mohamed Ariff, Azmah Hanim
Zahari, Nur Ismarrubie
Baserfalak, F.
author_sort Nahavandi, Mahdi
title Microstructural evaluation of Bi-Ag and Bi-Sb lead-free high-temperature solder candidates on copper substrate with multiple reflow number
title_short Microstructural evaluation of Bi-Ag and Bi-Sb lead-free high-temperature solder candidates on copper substrate with multiple reflow number
title_full Microstructural evaluation of Bi-Ag and Bi-Sb lead-free high-temperature solder candidates on copper substrate with multiple reflow number
title_fullStr Microstructural evaluation of Bi-Ag and Bi-Sb lead-free high-temperature solder candidates on copper substrate with multiple reflow number
title_full_unstemmed Microstructural evaluation of Bi-Ag and Bi-Sb lead-free high-temperature solder candidates on copper substrate with multiple reflow number
title_sort microstructural evaluation of bi-ag and bi-sb lead-free high-temperature solder candidates on copper substrate with multiple reflow number
publisher Trans Tech Publications
publishDate 2014
url http://psasir.upm.edu.my/id/eprint/34519/1/Microstructural%20evaluation%20of%20Bi-Ag%20and%20Bi-Sb%20lead-free%20high-temperature%20solder%20candidates%20on%20copper%20substrate%20with%20multiple%20reflow%20number.pdf
http://psasir.upm.edu.my/id/eprint/34519/
http://www.scientific.net/AMM.564.388
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score 13.211869

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