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The Development of a No-Clean Solder for Radio Frequency Power Module

The pursue of CFC elimination in many industries has opened up opportunity for the development of substitutes of CFC. No-clean solder is just one of the many examples in response to this need. This project describes the development of no-clean solder for radio frequency (RF) Power Module. Nine n...

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Main Author: Sns Bukhari, Mohabattul Zaman
Format: Thesis
Language:English
English
Published: 1997
Online Access:http://psasir.upm.edu.my/id/eprint/10021/1/FK_1997_15_A.pdf
http://psasir.upm.edu.my/id/eprint/10021/
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spelling my.upm.eprints.100212011-03-01T08:37:57Z http://psasir.upm.edu.my/id/eprint/10021/ The Development of a No-Clean Solder for Radio Frequency Power Module Sns Bukhari, Mohabattul Zaman The pursue of CFC elimination in many industries has opened up opportunity for the development of substitutes of CFC. No-clean solder is just one of the many examples in response to this need. This project describes the development of no-clean solder for radio frequency (RF) Power Module. Nine no-clean solder paste candidates ranging from different solder paste suppliers which are Heraeus, Indalloy, Multicore, Qualitek, Asahi Solders, Demetron, Koki, SCM and Alphametals were selected. Five solder preliminary tests which are flux weight loss, wetting, slump, solder balling, flux spread and four solder printing characteristics which are paste rolling solder coverage, solder fillet and joint texture were used as a tool to select the best no-clean solder that meet the product requirements. Heraeus and Indalloy no-clean solder pastes showed better results compared to others but still required some process changes. Two methods were used in order to eliminate the solder defects which are the development of the new stencil and new soldering reflow profile. These methods able to resolve the solder defects problem such as flux overflow, solder cold joint, solder splashing and solder balling formation. The selected no-clean solder paste together with the normal production solder paste known as control solder paste were further subjected to the paste level evaluations and the reliability tests. It was found that the Heraeus and Indalloy no-clean solder paste are the best candidates for noclean solder process capability. The results of these tests are presented and discussed in this thesis. 1997-01 Thesis NonPeerReviewed application/pdf en http://psasir.upm.edu.my/id/eprint/10021/1/FK_1997_15_A.pdf Sns Bukhari, Mohabattul Zaman (1997) The Development of a No-Clean Solder for Radio Frequency Power Module. Masters thesis, Universiti Putra Malaysia. English
institution Universiti Putra Malaysia
building UPM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Putra Malaysia
content_source UPM Institutional Repository
url_provider http://psasir.upm.edu.my/
language English
English
description The pursue of CFC elimination in many industries has opened up opportunity for the development of substitutes of CFC. No-clean solder is just one of the many examples in response to this need. This project describes the development of no-clean solder for radio frequency (RF) Power Module. Nine no-clean solder paste candidates ranging from different solder paste suppliers which are Heraeus, Indalloy, Multicore, Qualitek, Asahi Solders, Demetron, Koki, SCM and Alphametals were selected. Five solder preliminary tests which are flux weight loss, wetting, slump, solder balling, flux spread and four solder printing characteristics which are paste rolling solder coverage, solder fillet and joint texture were used as a tool to select the best no-clean solder that meet the product requirements. Heraeus and Indalloy no-clean solder pastes showed better results compared to others but still required some process changes. Two methods were used in order to eliminate the solder defects which are the development of the new stencil and new soldering reflow profile. These methods able to resolve the solder defects problem such as flux overflow, solder cold joint, solder splashing and solder balling formation. The selected no-clean solder paste together with the normal production solder paste known as control solder paste were further subjected to the paste level evaluations and the reliability tests. It was found that the Heraeus and Indalloy no-clean solder paste are the best candidates for noclean solder process capability. The results of these tests are presented and discussed in this thesis.
format Thesis
author Sns Bukhari, Mohabattul Zaman
spellingShingle Sns Bukhari, Mohabattul Zaman
The Development of a No-Clean Solder for Radio Frequency Power Module
author_facet Sns Bukhari, Mohabattul Zaman
author_sort Sns Bukhari, Mohabattul Zaman
title The Development of a No-Clean Solder for Radio Frequency Power Module
title_short The Development of a No-Clean Solder for Radio Frequency Power Module
title_full The Development of a No-Clean Solder for Radio Frequency Power Module
title_fullStr The Development of a No-Clean Solder for Radio Frequency Power Module
title_full_unstemmed The Development of a No-Clean Solder for Radio Frequency Power Module
title_sort development of a no-clean solder for radio frequency power module
publishDate 1997
url http://psasir.upm.edu.my/id/eprint/10021/1/FK_1997_15_A.pdf
http://psasir.upm.edu.my/id/eprint/10021/
_version_ 1643824475222835200
score 13.211869

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