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Temperature & zincation process effect on electrical resistivity of aluminum bond pad for under Bump Metallurgy (UBM)

The effect of temperature change to electrical resistivity of Aluminum bond pad (Al pad) on die surface of Under Bump Metallurgy (UBM) were discussed in this paper. Four categories of samples were involved in measurement; a sample without UBM and the samples with single, double and triple zincation...

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Main Authors: Kornain, Z., Ahmad, I., Omar, G.
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Published: 2017
Online Access:http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5329
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spelling my.uniten.dspace-53292017-11-15T02:57:33Z Temperature & zincation process effect on electrical resistivity of aluminum bond pad for under Bump Metallurgy (UBM) Kornain, Z. Ahmad, I. Omar, G. The effect of temperature change to electrical resistivity of Aluminum bond pad (Al pad) on die surface of Under Bump Metallurgy (UBM) were discussed in this paper. Four categories of samples were involved in measurement; a sample without UBM and the samples with single, double and triple zincation process. The measurement of current-voltage curve of each sample was obtained by using special instrument so called RF probe and Metric ICS Software. The calculation of resistance and it pattern in the graph form was obtained by using Microsoft Office Excel. The temperature of sample was determined by using hot plate. Result from the graph has shown that the resistance of sample with UBM was less than resistance of the sample without UBM. It also has shown that the more zincation process steps the less value of resistance was attained. In other graph, the pattern has shown that value of resistance was increased when the temperature was raised up. As conclusion, the lower resistance due to zincation process and low temperature was produced better electrical performance especially the speed of operation and good thermal dissipation. © 2004 IEEE. 2017-11-15T02:57:33Z 2017-11-15T02:57:33Z 2004 http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5329
institution Universiti Tenaga Nasional
building UNITEN Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Tenaga Nasional
content_source UNITEN Institutional Repository
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description The effect of temperature change to electrical resistivity of Aluminum bond pad (Al pad) on die surface of Under Bump Metallurgy (UBM) were discussed in this paper. Four categories of samples were involved in measurement; a sample without UBM and the samples with single, double and triple zincation process. The measurement of current-voltage curve of each sample was obtained by using special instrument so called RF probe and Metric ICS Software. The calculation of resistance and it pattern in the graph form was obtained by using Microsoft Office Excel. The temperature of sample was determined by using hot plate. Result from the graph has shown that the resistance of sample with UBM was less than resistance of the sample without UBM. It also has shown that the more zincation process steps the less value of resistance was attained. In other graph, the pattern has shown that value of resistance was increased when the temperature was raised up. As conclusion, the lower resistance due to zincation process and low temperature was produced better electrical performance especially the speed of operation and good thermal dissipation. © 2004 IEEE.
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author Kornain, Z.
Ahmad, I.
Omar, G.
spellingShingle Kornain, Z.
Ahmad, I.
Omar, G.
Temperature & zincation process effect on electrical resistivity of aluminum bond pad for under Bump Metallurgy (UBM)
author_facet Kornain, Z.
Ahmad, I.
Omar, G.
author_sort Kornain, Z.
title Temperature & zincation process effect on electrical resistivity of aluminum bond pad for under Bump Metallurgy (UBM)
title_short Temperature & zincation process effect on electrical resistivity of aluminum bond pad for under Bump Metallurgy (UBM)
title_full Temperature & zincation process effect on electrical resistivity of aluminum bond pad for under Bump Metallurgy (UBM)
title_fullStr Temperature & zincation process effect on electrical resistivity of aluminum bond pad for under Bump Metallurgy (UBM)
title_full_unstemmed Temperature & zincation process effect on electrical resistivity of aluminum bond pad for under Bump Metallurgy (UBM)
title_sort temperature & zincation process effect on electrical resistivity of aluminum bond pad for under bump metallurgy (ubm)
publishDate 2017
url http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5329
_version_ 1644493659172765696
score 13.222552

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