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The effect of number of zincation in Electroless Nickel Immersion Gold (ENIG) Under Bump Metallurgy (UBM) on reliability in microelectronics packaging

This paper discusses on the effect of number of zincation in Electroless Nickel Immersion Gold (ENIG) Under Bump Metallurgy (UBM) on reliability in microelectronics packaging. Double and triple Zincation of ENIG methods were used as comparison study. The effect of number of zincation to surface roug...

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Main Authors: Abdullah, S.H., Ahmad, I., Jalar, A.
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Published: 2017
Online Access:http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5307
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spelling my.uniten.dspace-53072017-11-15T02:57:26Z The effect of number of zincation in Electroless Nickel Immersion Gold (ENIG) Under Bump Metallurgy (UBM) on reliability in microelectronics packaging Abdullah, S.H. Ahmad, I. Jalar, A. This paper discusses on the effect of number of zincation in Electroless Nickel Immersion Gold (ENIG) Under Bump Metallurgy (UBM) on reliability in microelectronics packaging. Double and triple Zincation of ENIG methods were used as comparison study. The effect of number of zincation to surface roughness and surface morphology were investigated. All samples were subjected to reliability tests such as Multiple Reflow, High Temperature Storage Life (HTSL) and Temperature / Thermal Cycle (TC) according to Joint Electron Device Engineering Council (JEDEC) conditions. Scanning Electron Microscope (SEM) and Atomic Force Microscopy (AFM) were used as analytical tools in this study. In multiple reflow tests, no reliability failure found for triple zincation, however for double zincation of ENIG UBM, the failure revealed failure after 3 times of reflow cycle. Thermal fatigue failure for both double and triple zincation of ENIG UBM revealed after 100 hours and 200 hours of HTSL, respectively. For TC test, thermal fatigue failure occurred after 150 cycles, for both double and triple zincation of ENIG UBM. The external and internal crack observed for this failure. The crack growth for double zincation is always much bigger than the triple zincation of ENIG UBM for both HTSL and TC tests. As conclusion, triple zincation gives a better surface morphology of electroless nickel. Hence, it can achieve a reliable solder joint leads to better adhesion between UBM and solder ball therefore, it can achieve a reliable solder joint. © 2006 IEEE. 2017-11-15T02:57:26Z 2017-11-15T02:57:26Z 2006 http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5307
institution Universiti Tenaga Nasional
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country Malaysia
content_provider Universiti Tenaga Nasional
content_source UNITEN Institutional Repository
url_provider http://dspace.uniten.edu.my/
description This paper discusses on the effect of number of zincation in Electroless Nickel Immersion Gold (ENIG) Under Bump Metallurgy (UBM) on reliability in microelectronics packaging. Double and triple Zincation of ENIG methods were used as comparison study. The effect of number of zincation to surface roughness and surface morphology were investigated. All samples were subjected to reliability tests such as Multiple Reflow, High Temperature Storage Life (HTSL) and Temperature / Thermal Cycle (TC) according to Joint Electron Device Engineering Council (JEDEC) conditions. Scanning Electron Microscope (SEM) and Atomic Force Microscopy (AFM) were used as analytical tools in this study. In multiple reflow tests, no reliability failure found for triple zincation, however for double zincation of ENIG UBM, the failure revealed failure after 3 times of reflow cycle. Thermal fatigue failure for both double and triple zincation of ENIG UBM revealed after 100 hours and 200 hours of HTSL, respectively. For TC test, thermal fatigue failure occurred after 150 cycles, for both double and triple zincation of ENIG UBM. The external and internal crack observed for this failure. The crack growth for double zincation is always much bigger than the triple zincation of ENIG UBM for both HTSL and TC tests. As conclusion, triple zincation gives a better surface morphology of electroless nickel. Hence, it can achieve a reliable solder joint leads to better adhesion between UBM and solder ball therefore, it can achieve a reliable solder joint. © 2006 IEEE.
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author Abdullah, S.H.
Ahmad, I.
Jalar, A.
spellingShingle Abdullah, S.H.
Ahmad, I.
Jalar, A.
The effect of number of zincation in Electroless Nickel Immersion Gold (ENIG) Under Bump Metallurgy (UBM) on reliability in microelectronics packaging
author_facet Abdullah, S.H.
Ahmad, I.
Jalar, A.
author_sort Abdullah, S.H.
title The effect of number of zincation in Electroless Nickel Immersion Gold (ENIG) Under Bump Metallurgy (UBM) on reliability in microelectronics packaging
title_short The effect of number of zincation in Electroless Nickel Immersion Gold (ENIG) Under Bump Metallurgy (UBM) on reliability in microelectronics packaging
title_full The effect of number of zincation in Electroless Nickel Immersion Gold (ENIG) Under Bump Metallurgy (UBM) on reliability in microelectronics packaging
title_fullStr The effect of number of zincation in Electroless Nickel Immersion Gold (ENIG) Under Bump Metallurgy (UBM) on reliability in microelectronics packaging
title_full_unstemmed The effect of number of zincation in Electroless Nickel Immersion Gold (ENIG) Under Bump Metallurgy (UBM) on reliability in microelectronics packaging
title_sort effect of number of zincation in electroless nickel immersion gold (enig) under bump metallurgy (ubm) on reliability in microelectronics packaging
publishDate 2017
url http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5307
_version_ 1644493652728217600
score 13.222552

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