The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGA
Five different types of clean flux and no-clean flux, which are mainly used in flip chip die attach, have been analyzed in respect to the wettability of eutectic solder bump in flip chip PBGA. An experimental study is carried out to measure the spreading area of the eutectic solder bump processed wi...
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my.uniten.dspace-309892023-12-29T15:57:22Z The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGA Amin N. Cheah A.Y. Kornain Z. Ahmad I. 7102424614 26632778200 24341024000 12792216600 Brazing Dies Electronics packaging Eutectics Lead Melting point Welding Comparative studies Eutectic solders Experimental studies Flip chip dies Flip chip PBGA High Lead Solder Silicon die Thermal gravimetric analyzer Weight loss Soldering alloys Five different types of clean flux and no-clean flux, which are mainly used in flip chip die attach, have been analyzed in respect to the wettability of eutectic solder bump in flip chip PBGA. An experimental study is carried out to measure the spreading area of the eutectic solder bump processed with different types of flux. Various types of clean and no-clean flux are measured and placed on top of silicon die. The effect of the flux has been observed by measuring the spreading area of the eutectic solder bump processed with different types of clean and no-clean fluxes by using Leica Quin Colour (RGB) after the heat treatment. Comparative studies on clean and no-clean fluxes are therefore obtained. Clean flux has shown better wettability on the high lead solder pad proving it to be the optimum choice as also supported by the die pull results. Moreover, the fluxes are tested under thermal gravimetric analyzer (TGA) to observe the flux weight loss on the melting point of eutectic solder bump to correlate with the earlier results. � 2008 IEEE. Final 2023-12-29T07:57:22Z 2023-12-29T07:57:22Z 2008 Conference paper 10.1109/SMELEC.2008.4770347 2-s2.0-65949110148 https://www.scopus.com/inward/record.uri?eid=2-s2.0-65949110148&doi=10.1109%2fSMELEC.2008.4770347&partnerID=40&md5=43e5e9ff570efe203cd5b4b895d19a58 https://irepository.uniten.edu.my/handle/123456789/30989 4770347 393 397 Scopus |
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Brazing Dies Electronics packaging Eutectics Lead Melting point Welding Comparative studies Eutectic solders Experimental studies Flip chip dies Flip chip PBGA High Lead Solder Silicon die Thermal gravimetric analyzer Weight loss Soldering alloys |
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Brazing Dies Electronics packaging Eutectics Lead Melting point Welding Comparative studies Eutectic solders Experimental studies Flip chip dies Flip chip PBGA High Lead Solder Silicon die Thermal gravimetric analyzer Weight loss Soldering alloys Amin N. Cheah A.Y. Kornain Z. Ahmad I. The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGA |
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Five different types of clean flux and no-clean flux, which are mainly used in flip chip die attach, have been analyzed in respect to the wettability of eutectic solder bump in flip chip PBGA. An experimental study is carried out to measure the spreading area of the eutectic solder bump processed with different types of flux. Various types of clean and no-clean flux are measured and placed on top of silicon die. The effect of the flux has been observed by measuring the spreading area of the eutectic solder bump processed with different types of clean and no-clean fluxes by using Leica Quin Colour (RGB) after the heat treatment. Comparative studies on clean and no-clean fluxes are therefore obtained. Clean flux has shown better wettability on the high lead solder pad proving it to be the optimum choice as also supported by the die pull results. Moreover, the fluxes are tested under thermal gravimetric analyzer (TGA) to observe the flux weight loss on the melting point of eutectic solder bump to correlate with the earlier results. � 2008 IEEE. |
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7102424614 |
| author_facet |
7102424614 Amin N. Cheah A.Y. Kornain Z. Ahmad I. |
| format |
Conference paper |
| author |
Amin N. Cheah A.Y. Kornain Z. Ahmad I. |
| author_sort |
Amin N. |
| title |
The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGA |
| title_short |
The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGA |
| title_full |
The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGA |
| title_fullStr |
The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGA |
| title_full_unstemmed |
The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGA |
| title_sort |
effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip pbga |
| publishDate |
2023 |
| _version_ |
1806424081407410176 |
| score |
13.222552 |