Reduction of warpage occurrence on stack-die QFN using FEA and statistical method
Warpage is greatly affected by package geometries, such as dimension of matrix array, pad, die and passive components as well as molding compound properties. It is also related to thermal mismatch i.e. coefficient of thermal expansion (CTE) and reliability of passive components in the package. So in...
Saved in:
| Main Authors: | , , , |
|---|---|
| Other Authors: | |
| Format: | Conference paper |
| Published: |
2023
|
| Subjects: | |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| id |
my.uniten.dspace-30887 |
|---|---|
| record_format |
dspace |
| spelling |
my.uniten.dspace-308872023-12-29T15:55:18Z Reduction of warpage occurrence on stack-die QFN using FEA and statistical method Abdullah I. Ahmad I. Talib M.Z.M. Kamarudin M.N.B.C. 24721493100 12792216600 8309925600 57198018413 Dies Finite element method Optimization Packaging Probability density function Statistics Structural analysis Coefficient of thermal expansion CTE property Experimental data Matrix arrays Molding compound Optimal combination Optimum combination Package geometries Passive components QFN package Thermal mismatch Thermal properties Warpages Thermal expansion Warpage is greatly affected by package geometries, such as dimension of matrix array, pad, die and passive components as well as molding compound properties. It is also related to thermal mismatch i.e. coefficient of thermal expansion (CTE) and reliability of passive components in the package. So in order to reduce warpage occurrence in all packages, it is proposed that the combination of CTE properties of QFN packages layer need to be optimized. This study used finite element method (FEM) to perform extensive structural analysis of QFN package designs with respect to different combination of thermal properties and the possible occurrence of warpage. The results obtained were then verified with experimental data. The FEA method was able to simulate the warpage occurrence and the statistical method was able to identify the optimal combination of thermal properties of the layers. It was also found that the optimum combination of CTE properties will reduce the probability of the warpage occurrence. Final 2023-12-29T07:55:18Z 2023-12-29T07:55:18Z 2008 Conference paper 10.1109/IEMT.2008.5507788 2-s2.0-77955102501 https://www.scopus.com/inward/record.uri?eid=2-s2.0-77955102501&doi=10.1109%2fIEMT.2008.5507788&partnerID=40&md5=c44922f883895d70c3aea6e559f18fb9 https://irepository.uniten.edu.my/handle/123456789/30887 5507788 Scopus |
| institution |
Universiti Tenaga Nasional |
| building |
UNITEN Library |
| collection |
Institutional Repository |
| continent |
Asia |
| country |
Malaysia |
| content_provider |
Universiti Tenaga Nasional |
| content_source |
UNITEN Institutional Repository |
| url_provider |
http://dspace.uniten.edu.my/ |
| topic |
Dies Finite element method Optimization Packaging Probability density function Statistics Structural analysis Coefficient of thermal expansion CTE property Experimental data Matrix arrays Molding compound Optimal combination Optimum combination Package geometries Passive components QFN package Thermal mismatch Thermal properties Warpages Thermal expansion |
| spellingShingle |
Dies Finite element method Optimization Packaging Probability density function Statistics Structural analysis Coefficient of thermal expansion CTE property Experimental data Matrix arrays Molding compound Optimal combination Optimum combination Package geometries Passive components QFN package Thermal mismatch Thermal properties Warpages Thermal expansion Abdullah I. Ahmad I. Talib M.Z.M. Kamarudin M.N.B.C. Reduction of warpage occurrence on stack-die QFN using FEA and statistical method |
| description |
Warpage is greatly affected by package geometries, such as dimension of matrix array, pad, die and passive components as well as molding compound properties. It is also related to thermal mismatch i.e. coefficient of thermal expansion (CTE) and reliability of passive components in the package. So in order to reduce warpage occurrence in all packages, it is proposed that the combination of CTE properties of QFN packages layer need to be optimized. This study used finite element method (FEM) to perform extensive structural analysis of QFN package designs with respect to different combination of thermal properties and the possible occurrence of warpage. The results obtained were then verified with experimental data. The FEA method was able to simulate the warpage occurrence and the statistical method was able to identify the optimal combination of thermal properties of the layers. It was also found that the optimum combination of CTE properties will reduce the probability of the warpage occurrence. |
| author2 |
24721493100 |
| author_facet |
24721493100 Abdullah I. Ahmad I. Talib M.Z.M. Kamarudin M.N.B.C. |
| format |
Conference paper |
| author |
Abdullah I. Ahmad I. Talib M.Z.M. Kamarudin M.N.B.C. |
| author_sort |
Abdullah I. |
| title |
Reduction of warpage occurrence on stack-die QFN using FEA and statistical method |
| title_short |
Reduction of warpage occurrence on stack-die QFN using FEA and statistical method |
| title_full |
Reduction of warpage occurrence on stack-die QFN using FEA and statistical method |
| title_fullStr |
Reduction of warpage occurrence on stack-die QFN using FEA and statistical method |
| title_full_unstemmed |
Reduction of warpage occurrence on stack-die QFN using FEA and statistical method |
| title_sort |
reduction of warpage occurrence on stack-die qfn using fea and statistical method |
| publishDate |
2023 |
| _version_ |
1806425645062815744 |
| score |
13.211869 |