Effect of reflow soldering process on metallurgical bonding between Sn3.5Ag solder and ENIG substrates
Reflow soldering process is one of the important steps in the manufacturing process for ball grid arrays. The purpose of this study is to observe the metallurgical bonding between Sn3.5Ag solder ball and electroless nickel immersion gold (ENIG) substrates after reflow soldering process. The reflow s...
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my.uniten.dspace-295922023-12-28T15:05:44Z Effect of reflow soldering process on metallurgical bonding between Sn3.5Ag solder and ENIG substrates Muhammad N.A. Bais B.H. Ahmad I. Isnin A. 26531512000 9638472600 12792216600 24338529400 Elemental analysis Intermetallic compounds Metallurgical bonding Reflow profile Visual micrograph Ball grid arrays Chemical analysis Flip chip devices Intermetallics Metallurgy Rapid thermal annealing Rapid thermal processing Silver Soldering alloys Substrates Tin Electroless nickel immersion gold Manufacturing process Metallurgical bonding Peak temperatures Reflow profile Reflow--soldering Sn3.5Ag solder Solder joints Visual micrograph Soldering Reflow soldering process is one of the important steps in the manufacturing process for ball grid arrays. The purpose of this study is to observe the metallurgical bonding between Sn3.5Ag solder ball and electroless nickel immersion gold (ENIG) substrates after reflow soldering process. The reflow soldering process was performed at peak temperatures T peak of 246 and 251�C for 50 s by the rapid thermal processing system. Visual micrographs of these solder joints were performed in order to support the metallurgical bonding of Sn3.5Ag solder ball and ENIG substrate after the reflow soldering process. The formation of Ni 3Sn 4 intermetallic compounds (IMCs) at the Sn3.5Ag solder/Ni interface was dependent and continuous with one another compared to the initial IMC formation at Tpeak of ?246�C. It was also found that the initial IMCs thickness of Sn3.5Ag solder/Ni interface was lower and thinner at Tpeak of y251uC during the reflow soldering process. As a conclusion, the metallurgical bonding between Sn3?5Ag solder/ENIG substrate was formed better at T peak of ?251�C during the reflow soldering process using the rapid thermal processing system. � W. S. Maney & Son Ltd. 2011. Final 2023-12-28T07:05:44Z 2023-12-28T07:05:44Z 2011 Conference paper 10.1179/143307511X13031890749253 2-s2.0-84055200085 https://www.scopus.com/inward/record.uri?eid=2-s2.0-84055200085&doi=10.1179%2f143307511X13031890749253&partnerID=40&md5=1d3dc0a81221ed493d68c8d0b457cafd https://irepository.uniten.edu.my/handle/123456789/29592 15 SUPPL. 2 S213 S216 Scopus |
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Elemental analysis Intermetallic compounds Metallurgical bonding Reflow profile Visual micrograph Ball grid arrays Chemical analysis Flip chip devices Intermetallics Metallurgy Rapid thermal annealing Rapid thermal processing Silver Soldering alloys Substrates Tin Electroless nickel immersion gold Manufacturing process Metallurgical bonding Peak temperatures Reflow profile Reflow--soldering Sn3.5Ag solder Solder joints Visual micrograph Soldering |
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Elemental analysis Intermetallic compounds Metallurgical bonding Reflow profile Visual micrograph Ball grid arrays Chemical analysis Flip chip devices Intermetallics Metallurgy Rapid thermal annealing Rapid thermal processing Silver Soldering alloys Substrates Tin Electroless nickel immersion gold Manufacturing process Metallurgical bonding Peak temperatures Reflow profile Reflow--soldering Sn3.5Ag solder Solder joints Visual micrograph Soldering Muhammad N.A. Bais B.H. Ahmad I. Isnin A. Effect of reflow soldering process on metallurgical bonding between Sn3.5Ag solder and ENIG substrates |
| description |
Reflow soldering process is one of the important steps in the manufacturing process for ball grid arrays. The purpose of this study is to observe the metallurgical bonding between Sn3.5Ag solder ball and electroless nickel immersion gold (ENIG) substrates after reflow soldering process. The reflow soldering process was performed at peak temperatures T peak of 246 and 251�C for 50 s by the rapid thermal processing system. Visual micrographs of these solder joints were performed in order to support the metallurgical bonding of Sn3.5Ag solder ball and ENIG substrate after the reflow soldering process. The formation of Ni 3Sn 4 intermetallic compounds (IMCs) at the Sn3.5Ag solder/Ni interface was dependent and continuous with one another compared to the initial IMC formation at Tpeak of ?246�C. It was also found that the initial IMCs thickness of Sn3.5Ag solder/Ni interface was lower and thinner at Tpeak of y251uC during the reflow soldering process. As a conclusion, the metallurgical bonding between Sn3?5Ag solder/ENIG substrate was formed better at T peak of ?251�C during the reflow soldering process using the rapid thermal processing system. � W. S. Maney & Son Ltd. 2011. |
| author2 |
26531512000 |
| author_facet |
26531512000 Muhammad N.A. Bais B.H. Ahmad I. Isnin A. |
| format |
Conference paper |
| author |
Muhammad N.A. Bais B.H. Ahmad I. Isnin A. |
| author_sort |
Muhammad N.A. |
| title |
Effect of reflow soldering process on metallurgical bonding between Sn3.5Ag solder and ENIG substrates |
| title_short |
Effect of reflow soldering process on metallurgical bonding between Sn3.5Ag solder and ENIG substrates |
| title_full |
Effect of reflow soldering process on metallurgical bonding between Sn3.5Ag solder and ENIG substrates |
| title_fullStr |
Effect of reflow soldering process on metallurgical bonding between Sn3.5Ag solder and ENIG substrates |
| title_full_unstemmed |
Effect of reflow soldering process on metallurgical bonding between Sn3.5Ag solder and ENIG substrates |
| title_sort |
effect of reflow soldering process on metallurgical bonding between sn3.5ag solder and enig substrates |
| publishDate |
2023 |
| _version_ |
1806423240989474816 |
| score |
13.222552 |