Staff View: Effect of Needle Size and Needle Height to Substrate in Encapsulation Process of LED Packaging

Effect of Needle Size and Needle Height to Substrate in Encapsulation Process of LED Packaging

The purpose of this study is to investigate the effect of needle size and substrate to needle height by measuring the droplet volume and epoxy covered area in encapsulation process of LED packaging. Five needle gages (16G, 18G, 21G, 22G, and 23G) were used in this experiment. Average volume of epoxy...

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Main Authors:	Alim M.A., Abdullah M.Z., Aziz M.S.A., Kamarudin R., Rusdi M.S., Ishak M.H.H., Gunnasegaran P.
Other Authors:	57527077400
Format:	Book Chapter
Published:	Springer Science and Business Media Deutschland GmbH 2023
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id	my.uniten.dspace-27234
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spelling	my.uniten.dspace-272342023-05-29T17:41:21Z Effect of Needle Size and Needle Height to Substrate in Encapsulation Process of LED Packaging Alim M.A. Abdullah M.Z. Aziz M.S.A. Kamarudin R. Rusdi M.S. Ishak M.H.H. Gunnasegaran P. 57527077400 31567537400 36695908700 57215578097 57193642841 57189854965 35778031300 The purpose of this study is to investigate the effect of needle size and substrate to needle height by measuring the droplet volume and epoxy covered area in encapsulation process of LED packaging. Five needle gages (16G, 18G, 21G, 22G, and 23G) were used in this experiment. Average volume of epoxy drops was determined for each size of needle. Experimental data shows that droplet volumes are directly related with the needle diameter. Optimum covered area by the epoxy encapsulation was found at the needle tip to substrate distance at 3.240�mm for the 16G needle. These findings are relevant and helpful for controlling the amount of epoxy, encapsulation area, and the encapsulant shape in encapsulation process of LED packaging. � 2022, The Author(s), under exclusive license to Springer Nature Switzerland AG. Final 2023-05-29T09:41:21Z 2023-05-29T09:41:21Z 2022 Book Chapter 10.1007/978-3-030-92964-0_15 2-s2.0-85126654443 https://www.scopus.com/inward/record.uri?eid=2-s2.0-85126654443&doi=10.1007%2f978-3-030-92964-0_15&partnerID=40&md5=654eca2fb2e25b9c4613d46b4149704c https://irepository.uniten.edu.my/handle/123456789/27234 162 149 156 Springer Science and Business Media Deutschland GmbH Scopus
institution	Universiti Tenaga Nasional
building	UNITEN Library
collection	Institutional Repository
continent	Asia
country	Malaysia
content_provider	Universiti Tenaga Nasional
content_source	UNITEN Institutional Repository
url_provider	http://dspace.uniten.edu.my/
description	The purpose of this study is to investigate the effect of needle size and substrate to needle height by measuring the droplet volume and epoxy covered area in encapsulation process of LED packaging. Five needle gages (16G, 18G, 21G, 22G, and 23G) were used in this experiment. Average volume of epoxy drops was determined for each size of needle. Experimental data shows that droplet volumes are directly related with the needle diameter. Optimum covered area by the epoxy encapsulation was found at the needle tip to substrate distance at 3.240�mm for the 16G needle. These findings are relevant and helpful for controlling the amount of epoxy, encapsulation area, and the encapsulant shape in encapsulation process of LED packaging. � 2022, The Author(s), under exclusive license to Springer Nature Switzerland AG.
author2	57527077400
author_facet	57527077400 Alim M.A. Abdullah M.Z. Aziz M.S.A. Kamarudin R. Rusdi M.S. Ishak M.H.H. Gunnasegaran P.
format	Book Chapter
author	Alim M.A. Abdullah M.Z. Aziz M.S.A. Kamarudin R. Rusdi M.S. Ishak M.H.H. Gunnasegaran P.
spellingShingle	Alim M.A. Abdullah M.Z. Aziz M.S.A. Kamarudin R. Rusdi M.S. Ishak M.H.H. Gunnasegaran P. Effect of Needle Size and Needle Height to Substrate in Encapsulation Process of LED Packaging
author_sort	Alim M.A.
title	Effect of Needle Size and Needle Height to Substrate in Encapsulation Process of LED Packaging
title_short	Effect of Needle Size and Needle Height to Substrate in Encapsulation Process of LED Packaging
title_full	Effect of Needle Size and Needle Height to Substrate in Encapsulation Process of LED Packaging
title_fullStr	Effect of Needle Size and Needle Height to Substrate in Encapsulation Process of LED Packaging
title_full_unstemmed	Effect of Needle Size and Needle Height to Substrate in Encapsulation Process of LED Packaging
title_sort	effect of needle size and needle height to substrate in encapsulation process of led packaging
publisher	Springer Science and Business Media Deutschland GmbH
publishDate	2023
_version_	1806425638899286016
score	13.223943

Effect of Needle Size and Needle Height to Substrate in Encapsulation Process of LED Packaging

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