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Simulation design for thermal model from various materials in electronic devices: A review

Electronic equipment; Heat transfer performance; Thermography (temperature measurement); Device design; Electronics devices; Heat transfer performance; Property; Simulation Design; Simulation studies; Simulation;; Thermal management;; Thermal materials; Thermal model; Thermoelectric equipment

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Bibliographic Details
Main Authors: Bahru R., Zamri M.F.M.A., Shamsuddin A.H., Mohamed M.A.
Other Authors: 57195836029
Format: Review
Published: Taylor and Francis Ltd. 2023
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id my.uniten.dspace-27182
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spelling my.uniten.dspace-271822023-05-29T17:40:37Z Simulation design for thermal model from various materials in electronic devices: A review Bahru R. Zamri M.F.M.A. Shamsuddin A.H. Mohamed M.A. 57195836029 57354218900 35779071900 57581478900 Electronic equipment; Heat transfer performance; Thermography (temperature measurement); Device design; Electronics devices; Heat transfer performance; Property; Simulation Design; Simulation studies; Simulation;; Thermal management;; Thermal materials; Thermal model; Thermoelectric equipment The heat transfer performance in materials to remove heat is attained in various designs according to the devices� design. Simulation studies are comprising of heat transfer knowledge in detail suit the theories and applications. This review provides an understanding of the simulation work focusing on the heat transfer in the various design of electronic devices. This discussion begins with a briefing on the simulation principle and current focus. Then, the review continues by explaining various simulation methods that exhibit recent heat transfer analysis. The properties of simulation studies are also summarized in detail to understand the significant properties that impact analysis. The application of simulation in thermal model is looked forward to obtain significant heat transfer improvement and impactful research direction. This review also provides insights into challenges in simulation work with available opportunities to solve the heat transfer issue by understanding fundamental knowledge. � 2022 Taylor & Francis Group, LLC. Final 2023-05-29T09:40:36Z 2023-05-29T09:40:36Z 2022 Review 10.1080/10407782.2022.2083842 2-s2.0-85132176939 https://www.scopus.com/inward/record.uri?eid=2-s2.0-85132176939&doi=10.1080%2f10407782.2022.2083842&partnerID=40&md5=760dd7ceb9bab3822bb783daa103b944 https://irepository.uniten.edu.my/handle/123456789/27182 82 10 640 665 Taylor and Francis Ltd. Scopus
institution Universiti Tenaga Nasional
building UNITEN Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Tenaga Nasional
content_source UNITEN Institutional Repository
url_provider http://dspace.uniten.edu.my/
description Electronic equipment; Heat transfer performance; Thermography (temperature measurement); Device design; Electronics devices; Heat transfer performance; Property; Simulation Design; Simulation studies; Simulation;; Thermal management;; Thermal materials; Thermal model; Thermoelectric equipment
author2 57195836029
author_facet 57195836029
Bahru R.
Zamri M.F.M.A.
Shamsuddin A.H.
Mohamed M.A.
format Review
author Bahru R.
Zamri M.F.M.A.
Shamsuddin A.H.
Mohamed M.A.
spellingShingle Bahru R.
Zamri M.F.M.A.
Shamsuddin A.H.
Mohamed M.A.
Simulation design for thermal model from various materials in electronic devices: A review
author_sort Bahru R.
title Simulation design for thermal model from various materials in electronic devices: A review
title_short Simulation design for thermal model from various materials in electronic devices: A review
title_full Simulation design for thermal model from various materials in electronic devices: A review
title_fullStr Simulation design for thermal model from various materials in electronic devices: A review
title_full_unstemmed Simulation design for thermal model from various materials in electronic devices: A review
title_sort simulation design for thermal model from various materials in electronic devices: a review
publisher Taylor and Francis Ltd.
publishDate 2023
_version_ 1806427322985742336
score 13.222552

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