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Effect of contact angle on meniscus evolution and contact line jump of underfill fluid flow in flip-chip encapsulation

Despite the contact angle of underfill fluid is largely correlated to the flowability, it was scarcely being investigated in the design optimization of flip-chip underfill encapsulation process. Furthermore, the detailed implication of the variation of contact angle on the flow mechanism was never b...

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Main Authors: Ng F.C., Tung L.H., Zawawi M.H., Mukhtar M.A.F.M., Abas M.A., Abdullah M.Z.
Other Authors: 57192101900
Format: Article
Published: Penerbit Akademia Baru 2023
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spelling my.uniten.dspace-256842023-05-29T16:12:43Z Effect of contact angle on meniscus evolution and contact line jump of underfill fluid flow in flip-chip encapsulation Ng F.C. Tung L.H. Zawawi M.H. Mukhtar M.A.F.M. Abas M.A. Abdullah M.Z. 57192101900 57210387852 39162217600 57202800854 56893346700 31567537400 Despite the contact angle of underfill fluid is largely correlated to the flowability, it was scarcely being investigated in the design optimization of flip-chip underfill encapsulation process. Furthermore, the detailed implication of the variation of contact angle on the flow mechanism was never being discussed. Thus, this paper is devoted to study the variation effect of contact angle on both spatial aspects of meniscus evolution and contact line jump of underfill flow menisci. The governing analytical equations that describe both meniscus evolution and contact line jump were well-validated with the past experimental and numerical findings. It was revealed that the bump contact angle critically determined the separation between concave and convex menisci. Generally, larger bump contact angle yields the earlier formation of convex menisci that is nearer to the bump entrant. Consequently, the occurrence of convex menisci in the bump region increased for the case of high bump contact angle. Moreover, when the contact angle increases, the equilibrium positions of entrant jump meniscus locates nearer to the bump entrant; while the equilibrium meniscus of exit jump becomes further away from the bump exit. These findings provided microscopic insights of the influence of contact angle on the characteristic and dynamic of flow menisci upon interacting with the solder bump array, which may benefit both electronic packaging and microfluidics sectors in general. � 2020 PENERBIT AKADEMIA BARU-All rights reserved. Final 2023-05-29T08:12:43Z 2023-05-29T08:12:43Z 2020 Article 10.37934/cfdl.12.6.2838 2-s2.0-85090218199 https://www.scopus.com/inward/record.uri?eid=2-s2.0-85090218199&doi=10.37934%2fcfdl.12.6.2838&partnerID=40&md5=ff92c146b2a8bdbceb95e3d430de23c9 https://irepository.uniten.edu.my/handle/123456789/25684 12 6 28 38 All Open Access, Bronze Penerbit Akademia Baru Scopus
institution Universiti Tenaga Nasional
building UNITEN Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Tenaga Nasional
content_source UNITEN Institutional Repository
url_provider http://dspace.uniten.edu.my/
description Despite the contact angle of underfill fluid is largely correlated to the flowability, it was scarcely being investigated in the design optimization of flip-chip underfill encapsulation process. Furthermore, the detailed implication of the variation of contact angle on the flow mechanism was never being discussed. Thus, this paper is devoted to study the variation effect of contact angle on both spatial aspects of meniscus evolution and contact line jump of underfill flow menisci. The governing analytical equations that describe both meniscus evolution and contact line jump were well-validated with the past experimental and numerical findings. It was revealed that the bump contact angle critically determined the separation between concave and convex menisci. Generally, larger bump contact angle yields the earlier formation of convex menisci that is nearer to the bump entrant. Consequently, the occurrence of convex menisci in the bump region increased for the case of high bump contact angle. Moreover, when the contact angle increases, the equilibrium positions of entrant jump meniscus locates nearer to the bump entrant; while the equilibrium meniscus of exit jump becomes further away from the bump exit. These findings provided microscopic insights of the influence of contact angle on the characteristic and dynamic of flow menisci upon interacting with the solder bump array, which may benefit both electronic packaging and microfluidics sectors in general. � 2020 PENERBIT AKADEMIA BARU-All rights reserved.
author2 57192101900
author_facet 57192101900
Ng F.C.
Tung L.H.
Zawawi M.H.
Mukhtar M.A.F.M.
Abas M.A.
Abdullah M.Z.
format Article
author Ng F.C.
Tung L.H.
Zawawi M.H.
Mukhtar M.A.F.M.
Abas M.A.
Abdullah M.Z.
spellingShingle Ng F.C.
Tung L.H.
Zawawi M.H.
Mukhtar M.A.F.M.
Abas M.A.
Abdullah M.Z.
Effect of contact angle on meniscus evolution and contact line jump of underfill fluid flow in flip-chip encapsulation
author_sort Ng F.C.
title Effect of contact angle on meniscus evolution and contact line jump of underfill fluid flow in flip-chip encapsulation
title_short Effect of contact angle on meniscus evolution and contact line jump of underfill fluid flow in flip-chip encapsulation
title_full Effect of contact angle on meniscus evolution and contact line jump of underfill fluid flow in flip-chip encapsulation
title_fullStr Effect of contact angle on meniscus evolution and contact line jump of underfill fluid flow in flip-chip encapsulation
title_full_unstemmed Effect of contact angle on meniscus evolution and contact line jump of underfill fluid flow in flip-chip encapsulation
title_sort effect of contact angle on meniscus evolution and contact line jump of underfill fluid flow in flip-chip encapsulation
publisher Penerbit Akademia Baru
publishDate 2023
_version_ 1806427727995076608
score 13.211869

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