Multi beam laser grooving process parameter development and die strength characterization for 40nm node low-K/ULK wafer
Ablation; Cost effectiveness; Dies; Industrial electronics; Ion beams; Laser ablation; Neodymium alloys; Neodymium lasers; Scanning electron microscopy; Semiconductor lasers; Silicon wafers; Yttrium aluminum garnet; Inspection tools; Laser frequency; Laser micro-machining; Laser process parameters;...
Saved in:
| Main Authors: | , , , , |
|---|---|
| Other Authors: | |
| Format: | Conference Paper |
| Published: |
Institute of Electrical and Electronics Engineers Inc.
2023
|
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Summary: | Ablation; Cost effectiveness; Dies; Industrial electronics; Ion beams; Laser ablation; Neodymium alloys; Neodymium lasers; Scanning electron microscopy; Semiconductor lasers; Silicon wafers; Yttrium aluminum garnet; Inspection tools; Laser frequency; Laser micro-machining; Laser process parameters; Mass production; Package reliability; Process parameters; Throughput improvement; Laser beam effects |
|---|