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Insulated Cu wire free air ball characterization

Insulated Cu wire technology has immense potential for fine pitch wire bonding interconnection. Understanding the behavior of the insulated Cu free air ball (FAB) formation is crucial for wire bonding process. The FAB formation, size, shape and cleanliness under different conditions for 20 ?m insula...

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Main Authors: Leong H., Yap B., Khan N., Ibrahim M.R., Tan L.C.
Other Authors: 55787052600
Format: Article
Published: Elsevier Ltd 2023
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id my.uniten.dspace-22061
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spelling my.uniten.dspace-220612023-05-16T10:47:03Z Insulated Cu wire free air ball characterization Leong H. Yap B. Khan N. Ibrahim M.R. Tan L.C. 55787052600 26649255900 9736201900 16021986000 57661553500 Insulated Cu wire technology has immense potential for fine pitch wire bonding interconnection. Understanding the behavior of the insulated Cu free air ball (FAB) formation is crucial for wire bonding process. The FAB formation, size, shape and cleanliness under different conditions for 20 ?m insulated Cu wire were investigated using SEM, FESEM and FTIR surface analysis. The results were compared with that of bare Cu wire. Consistently spherical residue free FAB of insulated Cu wire were formed using forming gas. The samples with insulated Cu wire consistently produced larger FAB than that of bare Cu wire, indicating that the energy required for free air ball formation is lower. Basic bonding performances in terms of ball bond strength, intermetallic (IMC) coverage growth and stitch bond strength of insulated Cu wire at time zero are also discussed in the paper. © 2014 Elsevier Ltd. All rights. Final 2023-05-16T02:47:03Z 2023-05-16T02:47:03Z 2014 Article 10.1016/j.microrel.2014.03.015 2-s2.0-84905909926 https://www.scopus.com/inward/record.uri?eid=2-s2.0-84905909926&doi=10.1016%2fj.microrel.2014.03.015&partnerID=40&md5=b4f29a47a122c65783794b7d74456473 https://irepository.uniten.edu.my/handle/123456789/22061 54 8 1567 1574 Elsevier Ltd Scopus
institution Universiti Tenaga Nasional
building UNITEN Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Tenaga Nasional
content_source UNITEN Institutional Repository
url_provider http://dspace.uniten.edu.my/
description Insulated Cu wire technology has immense potential for fine pitch wire bonding interconnection. Understanding the behavior of the insulated Cu free air ball (FAB) formation is crucial for wire bonding process. The FAB formation, size, shape and cleanliness under different conditions for 20 ?m insulated Cu wire were investigated using SEM, FESEM and FTIR surface analysis. The results were compared with that of bare Cu wire. Consistently spherical residue free FAB of insulated Cu wire were formed using forming gas. The samples with insulated Cu wire consistently produced larger FAB than that of bare Cu wire, indicating that the energy required for free air ball formation is lower. Basic bonding performances in terms of ball bond strength, intermetallic (IMC) coverage growth and stitch bond strength of insulated Cu wire at time zero are also discussed in the paper. © 2014 Elsevier Ltd. All rights.
author2 55787052600
author_facet 55787052600
Leong H.
Yap B.
Khan N.
Ibrahim M.R.
Tan L.C.
format Article
author Leong H.
Yap B.
Khan N.
Ibrahim M.R.
Tan L.C.
spellingShingle Leong H.
Yap B.
Khan N.
Ibrahim M.R.
Tan L.C.
Insulated Cu wire free air ball characterization
author_sort Leong H.
title Insulated Cu wire free air ball characterization
title_short Insulated Cu wire free air ball characterization
title_full Insulated Cu wire free air ball characterization
title_fullStr Insulated Cu wire free air ball characterization
title_full_unstemmed Insulated Cu wire free air ball characterization
title_sort insulated cu wire free air ball characterization
publisher Elsevier Ltd
publishDate 2023
_version_ 1806428221317578752
score 13.223943

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