Manufacturability readiness of insulated Cu wire bonding process in PBGA package
Today, microelectronics devices are getting smaller with more I/Os. Conventional ultra fine pitch wire bonding is facing wire-to wire short and wire sweeping issues. The use of insulated Cu wire is a potential technology enabling greater wire density, and wires touching and crossing, as the wire is...
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| 主要な著者: | , , , , , |
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| フォーマット: | Conference Paper |
| 出版事項: |
Institute of Electrical and Electronics Engineers Inc.
2023
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