Analysis Of The Factors Affecting The Semiconductor Manufacturing System Using Simulation Based Modelling

Semiconductor is made of monocrystalline silicon as the primary material that can be used for the manufacture of a semiconductor device. For the sake of existence and succeed on a global market, manufacturing companies need to be imaginative in delivering revolutionary and superior goods with sho...

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Main Author: Zul Zaffri, Mustafa
Format: Final Year Project Report
Language:English
English
Published: Universiti Malaysia Sarawak, (UNIMAS) 2020
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spelling my.unimas.ir.370832024-03-19T02:34:10Z http://ir.unimas.my/id/eprint/37083/ Analysis Of The Factors Affecting The Semiconductor Manufacturing System Using Simulation Based Modelling Zul Zaffri, Mustafa TJ Mechanical engineering and machinery Semiconductor is made of monocrystalline silicon as the primary material that can be used for the manufacture of a semiconductor device. For the sake of existence and succeed on a global market, manufacturing companies need to be imaginative in delivering revolutionary and superior goods with short running times and competitive rates in order to achieve operational efficiencies, such as reliability, cost, distribution and versatility, must always fulfil their specifications (Eng, K. & Choi, K., 2016). The main idea of this study is to develop and analyse the simulation model of semiconductor manufacturing process. The objective of this study is to develop a simulation model based on the conceptual model of the semiconductor production. In addition, by using the experiment model, the factors number of curing machine, percentage rate rejection of frame at curing process and number of clip bond machine were investigated to study their effect on system performance parameters. The production output and production time of semiconductor are the main factors that determine the capability of semiconductor plant. Therefore, the data of production were collected from AMKOR Technology Malaysia Sdn. Bhd located at the Telok Panglima Garang, Selangor. Based on the data collected, a conceptual model is developed based on the process flow in the plant before converting it into simulation model in ARENA platform. The simulation model was further verified, determination of warm-up period, validated and experimented. The results from the ., experiment study were collected according to design of experiment (DOE). Then, ANOV A analysis was conducted to compare the main effect and the interaction between the factors. The sensitivity analysis was carried out on the simulation model to see whether system performance parameter is sensitive towards the change in system variables. The main findings are discussed and interpreted on the basis of the data collection derived from the simulation model. The factor number of curing machine shows that production cycle time and production quantity not changed. Factor percentage rejection frame at curing process, the cycle time of the manufacturing process is no changed, but the quantity output was decreased continuously. Finally, factor number of clip bond machine increased, the time of the production cycle is remained no change and the quantity of production inconsistently increased. Universiti Malaysia Sarawak, (UNIMAS) 2020 Final Year Project Report NonPeerReviewed text en http://ir.unimas.my/id/eprint/37083/1/Zul%20Zaffri%20%2824pgs%29.pdf text en http://ir.unimas.my/id/eprint/37083/4/Zul%20Zaffri%20%28fulltext%29.pdf Zul Zaffri, Mustafa (2020) Analysis Of The Factors Affecting The Semiconductor Manufacturing System Using Simulation Based Modelling. [Final Year Project Report] (Unpublished)
institution Universiti Malaysia Sarawak
building Centre for Academic Information Services (CAIS)
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Sarawak
content_source UNIMAS Institutional Repository
url_provider http://ir.unimas.my/
language English
English
topic TJ Mechanical engineering and machinery
spellingShingle TJ Mechanical engineering and machinery
Zul Zaffri, Mustafa
Analysis Of The Factors Affecting The Semiconductor Manufacturing System Using Simulation Based Modelling
description Semiconductor is made of monocrystalline silicon as the primary material that can be used for the manufacture of a semiconductor device. For the sake of existence and succeed on a global market, manufacturing companies need to be imaginative in delivering revolutionary and superior goods with short running times and competitive rates in order to achieve operational efficiencies, such as reliability, cost, distribution and versatility, must always fulfil their specifications (Eng, K. & Choi, K., 2016). The main idea of this study is to develop and analyse the simulation model of semiconductor manufacturing process. The objective of this study is to develop a simulation model based on the conceptual model of the semiconductor production. In addition, by using the experiment model, the factors number of curing machine, percentage rate rejection of frame at curing process and number of clip bond machine were investigated to study their effect on system performance parameters. The production output and production time of semiconductor are the main factors that determine the capability of semiconductor plant. Therefore, the data of production were collected from AMKOR Technology Malaysia Sdn. Bhd located at the Telok Panglima Garang, Selangor. Based on the data collected, a conceptual model is developed based on the process flow in the plant before converting it into simulation model in ARENA platform. The simulation model was further verified, determination of warm-up period, validated and experimented. The results from the ., experiment study were collected according to design of experiment (DOE). Then, ANOV A analysis was conducted to compare the main effect and the interaction between the factors. The sensitivity analysis was carried out on the simulation model to see whether system performance parameter is sensitive towards the change in system variables. The main findings are discussed and interpreted on the basis of the data collection derived from the simulation model. The factor number of curing machine shows that production cycle time and production quantity not changed. Factor percentage rejection frame at curing process, the cycle time of the manufacturing process is no changed, but the quantity output was decreased continuously. Finally, factor number of clip bond machine increased, the time of the production cycle is remained no change and the quantity of production inconsistently increased.
format Final Year Project Report
author Zul Zaffri, Mustafa
author_facet Zul Zaffri, Mustafa
author_sort Zul Zaffri, Mustafa
title Analysis Of The Factors Affecting The Semiconductor Manufacturing System Using Simulation Based Modelling
title_short Analysis Of The Factors Affecting The Semiconductor Manufacturing System Using Simulation Based Modelling
title_full Analysis Of The Factors Affecting The Semiconductor Manufacturing System Using Simulation Based Modelling
title_fullStr Analysis Of The Factors Affecting The Semiconductor Manufacturing System Using Simulation Based Modelling
title_full_unstemmed Analysis Of The Factors Affecting The Semiconductor Manufacturing System Using Simulation Based Modelling
title_sort analysis of the factors affecting the semiconductor manufacturing system using simulation based modelling
publisher Universiti Malaysia Sarawak, (UNIMAS)
publishDate 2020
url http://ir.unimas.my/id/eprint/37083/1/Zul%20Zaffri%20%2824pgs%29.pdf
http://ir.unimas.my/id/eprint/37083/4/Zul%20Zaffri%20%28fulltext%29.pdf
http://ir.unimas.my/id/eprint/37083/
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score 13.211869