Wet chemical cleaning effect on the formation of ultrathin interfacial layer between Germanium (Ge) and high-k dielectric
This paper investigates and discusses the effect of wet chemical cleaning; Hydrochloric Acid (HCl) and Hydrofluoric Acid (HF) to the growth of interfacial layer between high-k material (Al2O3) and Ge (100) surface. Characterization and morphology techniques using Field Emission Scanning Electron Mic...
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Main Authors: | , , , |
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Format: | E-Article |
Language: | English |
Published: |
Institute of Electrical and Electronics Engineers Inc.
2015
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Online Access: | http://ir.unimas.my/id/eprint/15193/1/Wet-chemical-cleaning-effect-on-the-formation-of-ultrathin-interfacial-layer-between-Germanium-%28Ge%29-and-high-k-dielectric_2015_RSM-2015---2015-IEEE-Regional-Symposium-on-Micro-and-Nano-Electronics%2C-Proceedin.html http://ir.unimas.my/id/eprint/15193/ https://www.scopus.com/inward/record.uri?eid=2-s2.0-84963860989&doi=10.1109%2fRSM.2015.7355015&partnerID=40&md5=2e41feec1ba73298f81daab61b1e5d2c |
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http://ir.unimas.my/id/eprint/15193/1/Wet-chemical-cleaning-effect-on-the-formation-of-ultrathin-interfacial-layer-between-Germanium-%28Ge%29-and-high-k-dielectric_2015_RSM-2015---2015-IEEE-Regional-Symposium-on-Micro-and-Nano-Electronics%2C-Proceedin.htmlhttp://ir.unimas.my/id/eprint/15193/
https://www.scopus.com/inward/record.uri?eid=2-s2.0-84963860989&doi=10.1109%2fRSM.2015.7355015&partnerID=40&md5=2e41feec1ba73298f81daab61b1e5d2c