Electroless copper deposition using sugar as the reducing agent
Electroless copper plating has been widely used in electroplate printed circuit board and metallising non-conducting components. Electroless plating is based on the reduction of metal ion on the surface of the non-conductor. The reducing agent used, formaldehyde is problematic since it is not...
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| Main Author: | |
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| Format: | Final Year Project Report |
| Language: | English |
| Published: |
Universiti Malaysia Sarawak, (UNIMAS)
1998
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| Online Access: | http://ir.unimas.my/id/eprint/46948/1/Ng%20Chee%20Heng%20ft.pdf http://ir.unimas.my/id/eprint/46948/ |
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