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Growth of Cu-Zn5 and Cu5Zn8 intermetallic compounds in the Sn-9Zn/Cu joint during liquid state aging

International Conference on X-Rays and Related Techniques in Research and Industry (ICXRI 2010) jointly organized by Universiti Malaysia Perlis (UniMAP) and X-Ray Application Malaysia Society (XAPP), 9th - 10th June 2010 at Aseania Resort Langkawi, Malaysia.

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Bibliographic Details
Main Authors: Ramani, Mayappan, Rosyaini, A. Zaman, Zalina, Z. Abidin, Asmawati@FatinNajihah, Alias, Mohd N., Derman
Other Authors: ramani@perlis.uitm.edu.my
Format: Working Paper
Language:English
Published: Universiti Malaysia Perlis 2010
Subjects:
Cu5Zn8 Intermetallic
Lead-free Solder
Sn-Zn Solder
Energy dispersive x-ray (EDX)
International Conference on X-Rays & Related Techniques in Research & Industry (ICXRI)
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/9060
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spelling my.unimap-90602010-08-24T09:10:33Z Growth of Cu-Zn5 and Cu5Zn8 intermetallic compounds in the Sn-9Zn/Cu joint during liquid state aging Ramani, Mayappan Rosyaini, A. Zaman Zalina, Z. Abidin Asmawati@FatinNajihah, Alias Mohd N., Derman ramani@perlis.uitm.edu.my Cu5Zn8 Intermetallic Lead-free Solder Sn-Zn Solder Energy dispersive x-ray (EDX) International Conference on X-Rays & Related Techniques in Research & Industry (ICXRI) International Conference on X-Rays and Related Techniques in Research and Industry (ICXRI 2010) jointly organized by Universiti Malaysia Perlis (UniMAP) and X-Ray Application Malaysia Society (XAPP), 9th - 10th June 2010 at Aseania Resort Langkawi, Malaysia. The phase and intermetallic thickness of Cu-Zn5 and Cu5Zn8 has been investigated under liquid state aging using reflow method. Both the intermetallic was formed by reacting Sn-9Zn lead free solder with copper substrate. Scanning electron microscope (SEM) was used to see the morphology of the phases and energy dispersive x-ray (EDX) was used to estimate the elemental compositions of the phases. The morphology of the Cu5Zn8 phase was rather flat but when the soldering temperature and tine increases, the morphology becomes scallop. Intermetallic thickness measurements show that the thickness of the Cu-Zn5 decreases with increasing soldering time and temperature. Whereas, the thickness of the Cu5Zn8 intermetallic increases with soldering time and temperature. 2010-08-24T09:10:33Z 2010-08-24T09:10:33Z 2010-06-09 Working Paper p.123-127 978-967-5760-02-0 http://hdl.handle.net/123456789/9060 en Proceedings of the International Conference on X-Rays & Related Techniques in Research & Industry (ICXRI) 2010 Universiti Malaysia Perlis School of Materials Engineering & School of Environmental Engineering
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Cu5Zn8 Intermetallic
Lead-free Solder
Sn-Zn Solder
Energy dispersive x-ray (EDX)
International Conference on X-Rays & Related Techniques in Research & Industry (ICXRI)
spellingShingle Cu5Zn8 Intermetallic
Lead-free Solder
Sn-Zn Solder
Energy dispersive x-ray (EDX)
International Conference on X-Rays & Related Techniques in Research & Industry (ICXRI)
Ramani, Mayappan
Rosyaini, A. Zaman
Zalina, Z. Abidin
Asmawati@FatinNajihah, Alias
Mohd N., Derman
Growth of Cu-Zn5 and Cu5Zn8 intermetallic compounds in the Sn-9Zn/Cu joint during liquid state aging
description International Conference on X-Rays and Related Techniques in Research and Industry (ICXRI 2010) jointly organized by Universiti Malaysia Perlis (UniMAP) and X-Ray Application Malaysia Society (XAPP), 9th - 10th June 2010 at Aseania Resort Langkawi, Malaysia.
author2 ramani@perlis.uitm.edu.my
author_facet ramani@perlis.uitm.edu.my
Ramani, Mayappan
Rosyaini, A. Zaman
Zalina, Z. Abidin
Asmawati@FatinNajihah, Alias
Mohd N., Derman
format Working Paper
author Ramani, Mayappan
Rosyaini, A. Zaman
Zalina, Z. Abidin
Asmawati@FatinNajihah, Alias
Mohd N., Derman
author_sort Ramani, Mayappan
title Growth of Cu-Zn5 and Cu5Zn8 intermetallic compounds in the Sn-9Zn/Cu joint during liquid state aging
title_short Growth of Cu-Zn5 and Cu5Zn8 intermetallic compounds in the Sn-9Zn/Cu joint during liquid state aging
title_full Growth of Cu-Zn5 and Cu5Zn8 intermetallic compounds in the Sn-9Zn/Cu joint during liquid state aging
title_fullStr Growth of Cu-Zn5 and Cu5Zn8 intermetallic compounds in the Sn-9Zn/Cu joint during liquid state aging
title_full_unstemmed Growth of Cu-Zn5 and Cu5Zn8 intermetallic compounds in the Sn-9Zn/Cu joint during liquid state aging
title_sort growth of cu-zn5 and cu5zn8 intermetallic compounds in the sn-9zn/cu joint during liquid state aging
publisher Universiti Malaysia Perlis
publishDate 2010
url http://dspace.unimap.edu.my/xmlui/handle/123456789/9060
_version_ 1643789380305813504
score 13.211869

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