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Effect of Zinc additions on Sn-0.7Cu-0.05Ni lead free solder alloy

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Bibliographic Details
Main Author: Nurul Ashikin, Saleh
Other Authors: School of Materials Engineering
Format: Other
Language:English
Published: Universiti Malaysia Perlis (UniMAP) 2022
Subjects:
Zinc
Alloys
Solder
Soldering
Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/77909
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spelling my.unimap-779092023-02-22T06:32:14Z Effect of Zinc additions on Sn-0.7Cu-0.05Ni lead free solder alloy Nurul Ashikin, Saleh School of Materials Engineering Zinc Alloys Solder Soldering Access is limited to UniMAP community. This project is focusing on the effect of zinc additions on Sn-0.7Cu-0.05Ni lead free solder alloy. The additional of micro-alloying have been developed by using casting technique with different percentage of zinc which is 0.5, 1.0 and 1.5 wt.%. This casting technique is used by melting the different percentage of zinc with Sn-0.7Cu-0.05Ni above their melting point. This research project sample is divided into two types which are in bulk solder and substrate solder. Bulk solder samples are prepared in button shape only but for the substrate solder, it needs through the reflow soldering process between the solder alloy and copper pads. In this process, flux (Rosin) is used as a medium to eliminate oxide. The substrate solder was cross-sectioned before it has been analysis. In order to find the suitable method for this research project, the data collection is done by reviewing the data that were found in others research project. The Sn-0.7Cu-0.05Ni solder alloy samples were analyzed using optical microscope (OM), scanning electron microscopy (SEM), X-ray diffraction (XRD), differential scanning calorimetry (DSC) and Vickers hardness testing. All the method is carried out to investigate the microstructure, thickness of intermetallic compounds (IMCs), wettability, phase, thermal and hardness of Sn-0.7Cu-0.05Ni solder alloys. From this study, it is found that different composition of zinc affected the physical and mechanical properties of Sn-0.7Cu-0.05Ni solder alloys. 2022-08 2023-02-22T06:32:13Z 2023-02-22T06:32:13Z 2017-06 Other http://dspace.unimap.edu.my:80/xmlui/handle/123456789/77909 en Universiti Malaysia Perlis (UniMAP)
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Zinc
Alloys
Solder
Soldering
spellingShingle Zinc
Alloys
Solder
Soldering
Nurul Ashikin, Saleh
Effect of Zinc additions on Sn-0.7Cu-0.05Ni lead free solder alloy
description Access is limited to UniMAP community.
author2 School of Materials Engineering
author_facet School of Materials Engineering
Nurul Ashikin, Saleh
format Other
author Nurul Ashikin, Saleh
author_sort Nurul Ashikin, Saleh
title Effect of Zinc additions on Sn-0.7Cu-0.05Ni lead free solder alloy
title_short Effect of Zinc additions on Sn-0.7Cu-0.05Ni lead free solder alloy
title_full Effect of Zinc additions on Sn-0.7Cu-0.05Ni lead free solder alloy
title_fullStr Effect of Zinc additions on Sn-0.7Cu-0.05Ni lead free solder alloy
title_full_unstemmed Effect of Zinc additions on Sn-0.7Cu-0.05Ni lead free solder alloy
title_sort effect of zinc additions on sn-0.7cu-0.05ni lead free solder alloy
publisher Universiti Malaysia Perlis (UniMAP)
publishDate 2022
url http://dspace.unimap.edu.my:80/xmlui/handle/123456789/77909
_version_ 1772813084671344640
score 13.222552

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