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Nanoindentation of graphene reinforced epoxy resin as a conductive ink for microelectronic packaging application

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Main Authors: Maizura, Mokhlis, Mohd Azli, Salim, Nor Azmmi, Masripan, Adzni, Md. Saad, Mohd Nizam, Sudin, Ghazali, Omar, Caridi, Francesco
Other Authors: azli@utem.edu.my
Format: Article
Language:English
Published: Universiti Malaysia Perlis (UniMAP) 2020
Subjects:
Graphene nanoplatelets
Nanoindentation
Hardness
Young’s Modulus
Conductive Ink
Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68833
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spelling my.unimap-688332020-12-07T04:01:00Z Nanoindentation of graphene reinforced epoxy resin as a conductive ink for microelectronic packaging application Maizura, Mokhlis Mohd Azli, Salim Nor Azmmi, Masripan Adzni, Md. Saad Mohd Nizam, Sudin Ghazali, Omar Caridi, Francesco azli@utem.edu.my Graphene nanoplatelets Nanoindentation Hardness Young’s Modulus Conductive Ink Link to publisher's homepage at http://ijneam.unimap.edu.my Conductive ink is a special type of ink which allows current to flow through the ink. There are several varieties of conductive inks in the market and it is crucial to choose a suitable ink for the electronic applications. Graphene material is chosen to replace the current ink due to its promising properties that have been explored by many researchers. This paper aims to investigate the effect of temperature and percentage of graphene ink on hardness and Young's modulus of printed graphene ink samples. Samples were fabricated using a simple method involving formulating, mixing, printing and curing processes and the ink was printed on the glass slide substrate. The samples were cured at 160°C and 180°C for one hour. The mechanical properties of printed graphene ink sample were evaluated using Dynamic Ultra Micro Hardness (DUMH). All the measurements were done with the same force of indentation to avoid the possibility of perforation of printed graphene ink. The results show that higher curing temperature and percentage of filler loading give bigger Young’s modulus and hardness of the printed graphene ink sample 2020-12-07T04:01:00Z 2020-12-07T04:01:00Z 2020-05 Article International Journal of Nanoelectronics and Materials, vol.13(Special Issue), 2020, pages 407-418 1985-5761 (Printed) 1997-4434 (Online) http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68833 http://ijneam.unimap.edu.my en International Symposium on Science, Technology and Engineering (ISSTE 2019); Universiti Malaysia Perlis (UniMAP)
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Graphene nanoplatelets
Nanoindentation
Hardness
Young’s Modulus
Conductive Ink
spellingShingle Graphene nanoplatelets
Nanoindentation
Hardness
Young’s Modulus
Conductive Ink
Maizura, Mokhlis
Mohd Azli, Salim
Nor Azmmi, Masripan
Adzni, Md. Saad
Mohd Nizam, Sudin
Ghazali, Omar
Caridi, Francesco
Nanoindentation of graphene reinforced epoxy resin as a conductive ink for microelectronic packaging application
description Link to publisher's homepage at http://ijneam.unimap.edu.my
author2 azli@utem.edu.my
author_facet azli@utem.edu.my
Maizura, Mokhlis
Mohd Azli, Salim
Nor Azmmi, Masripan
Adzni, Md. Saad
Mohd Nizam, Sudin
Ghazali, Omar
Caridi, Francesco
format Article
author Maizura, Mokhlis
Mohd Azli, Salim
Nor Azmmi, Masripan
Adzni, Md. Saad
Mohd Nizam, Sudin
Ghazali, Omar
Caridi, Francesco
author_sort Maizura, Mokhlis
title Nanoindentation of graphene reinforced epoxy resin as a conductive ink for microelectronic packaging application
title_short Nanoindentation of graphene reinforced epoxy resin as a conductive ink for microelectronic packaging application
title_full Nanoindentation of graphene reinforced epoxy resin as a conductive ink for microelectronic packaging application
title_fullStr Nanoindentation of graphene reinforced epoxy resin as a conductive ink for microelectronic packaging application
title_full_unstemmed Nanoindentation of graphene reinforced epoxy resin as a conductive ink for microelectronic packaging application
title_sort nanoindentation of graphene reinforced epoxy resin as a conductive ink for microelectronic packaging application
publisher Universiti Malaysia Perlis (UniMAP)
publishDate 2020
url http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68833
_version_ 1698698526971658240
score 13.222552

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