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The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering

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Main Authors: ‪Mohd Izrul Izwan, Ramli‬, Mohd Arif Anuar, Mohd Salleh, H., Yasuda, J., Chaiprapa, K., Nogita
Other Authors: mohdizrulizwan@gmail.com
Format: Article
Language:English
Published: Elsevier 2020
Subjects:
Soldering
Solder
Interconnects
Intermetallics
Solid solution
Microstructure
Solder properties
Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68724
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spelling my.unimap-687242020-11-13T03:44:05Z The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering ‪Mohd Izrul Izwan, Ramli‬ Mohd Arif Anuar, Mohd Salleh H., Yasuda J., Chaiprapa K., Nogita mohdizrulizwan@gmail.com arifanuar@unimap.edu.my yasuda.hideyuki.6s@kyoto-u.ac.jp jitrin@slri.or.th k.nogita@uq.edu.au Soldering Solder Interconnects Intermetallics Solid solution Microstructure Solder properties Link to publisher's homepage at https://www.sciencedirect.com/ This paper elucidated the effects of the Bi element (0 wt%, 0.5 wt% and 1.5 wt%) on the microstructure, electrical, wettability and mechanical properties of the Sn-0.7Cu-0.05Ni as a high strength solder. Besides using the conventional cross-sectioned microstructure image, the real-time synchrotron radiation imaging and synchrotron micro-X-ray fluorescence (XRF) technique was also used to investigate the microstructure, focusing on the in-situ growth behaviour of the primary (Cu,Ni)6Sn5 intermetallic and elemental distribution that had occurred in the Sn-0.7Cu-0.05Ni-1.5Bi. Other essential properties of solder material, such as wettability, electrical resistance, and shear strength, were also determined. The results showed that the addition of 1.5 wt% Bi refined the primary (Cu,Ni)6Sn5 intermetallics formation in the solder joint, where it grew earlier and faster relative to that in the Sn-0.7Cu-0.05Ni/Cu joint. Additionally, the addition of 1.5 wt% Bi resulted with a 3% reduction of its electrical resistance while increasing the wettability of the solder alloy. 1.5 wt% addition of the Bi element also found to have contributed to a significant increment of shear strength relative to that of the Sn-0.7Cu-0.05Ni. The results confirmed that the developed material is applicable as a potential high strength solder material in the context of advanced interconnecting applications. 2020-11-13T03:44:05Z 2020-11-13T03:44:05Z 2019-10 Article Materials & Design, vol.186, 2020, 16 pages 0264-1275 (print) 1873-4197 (online) http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68724 https://doi.org/10.1016/j.matdes.2019.108281 en Elsevier
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Soldering
Solder
Interconnects
Intermetallics
Solid solution
Microstructure
Solder properties
spellingShingle Soldering
Solder
Interconnects
Intermetallics
Solid solution
Microstructure
Solder properties
‪Mohd Izrul Izwan, Ramli‬
Mohd Arif Anuar, Mohd Salleh
H., Yasuda
J., Chaiprapa
K., Nogita
The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering
description Link to publisher's homepage at https://www.sciencedirect.com/
author2 mohdizrulizwan@gmail.com
author_facet mohdizrulizwan@gmail.com
‪Mohd Izrul Izwan, Ramli‬
Mohd Arif Anuar, Mohd Salleh
H., Yasuda
J., Chaiprapa
K., Nogita
format Article
author ‪Mohd Izrul Izwan, Ramli‬
Mohd Arif Anuar, Mohd Salleh
H., Yasuda
J., Chaiprapa
K., Nogita
author_sort ‪Mohd Izrul Izwan, Ramli‬
title The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering
title_short The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering
title_full The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering
title_fullStr The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering
title_full_unstemmed The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering
title_sort effect of bi on the microstructure, electrical, wettability and mechanical properties of sn-0.7cu-0.05ni alloys for high strength soldering
publisher Elsevier
publishDate 2020
url http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68724
_version_ 1698698501715656704
score 13.222552

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