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Estimation of thermal contact resistance in metal-plastic interface of semiconducting electronic devices

Link to publisher's homepage at http://www.unimap.edu.my/ ; Open access only applicable for vol. 1; issue 1, 2008 & vol. 2; issue 1, 2009.

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Bibliographic Details
Main Authors: Oke, S.A., Oyekunle, A.A., Salau, T.A.O., Adegbemile, A.A., Lawal, K.O.
Format: Article
Language:English
Published: Universiti Malaysia Perlis 2009
Subjects:
Thermal
Resistance
Plastics
Performance
Electronic devices
Heat > Transmission
Surfaces (Physics)
Thermal analysis
Surfaces (Technology).
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/5340
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spelling my.unimap-53402009-11-25T08:45:04Z Estimation of thermal contact resistance in metal-plastic interface of semiconducting electronic devices Oke, S.A. Oyekunle, A.A. Salau, T.A.O. Adegbemile, A.A. Lawal, K.O. Thermal Resistance Plastics Performance Electronic devices Heat -- Transmission Surfaces (Physics) Thermal analysis Surfaces (Technology). Link to publisher's homepage at http://www.unimap.edu.my/ ; Open access only applicable for vol. 1; issue 1, 2008 & vol. 2; issue 1, 2009. For decade, thermal contact resistance (TCR) has been measured experimentally. Unfortunately, the database, which should regularly support decision-making on TCR coefficients, seems not to exist. Thus, companies result to using outdated or irrelevant data that limits lifespan of electronics devices, their performance and reliability. This paper mathematically models the problem of TCR between two media (plastic-metal interface) in semi conductors with reference to resistance and the flow of heat accross or interface of two surfaces that area in contact, particularly in engineering applications. In this paper, a semiconductor/heat sink assembly is used to model the behaviour of thermal contact resistance. A cylindrical shaped semi-conductor was conceptualised, with the governing differential equations derived and the boundary conditions for the problem stated. The effect of parameters such as surface roughness, contact pressure, density of interstitial gas, heat capacity, thermal and mechanical properties on the temperature at the center of the semi-conductor was studied. From the analysis, it can be inferred that by effectively lowering thermal contact resistance, efficient heat tranfer results, which helps to prolong the life and reliability of the semi-conductor. The current work is motivated to fill an important gap that may be beneficial to practitioners in the semi-conductor industry. 2009-04-06T13:50:37Z 2009-04-06T13:50:37Z 2009 Article International Journal of Nanoelectronics and Materials, vol. 2 (1), 2009, pages 22-39. 1985-5761 (Printed) 1997-4434 (Online) http://hdl.handle.net/123456789/5340 http://www.unimap.edu.my en Universiti Malaysia Perlis
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Thermal
Resistance
Plastics
Performance
Electronic devices
Heat -- Transmission
Surfaces (Physics)
Thermal analysis
Surfaces (Technology).
spellingShingle Thermal
Resistance
Plastics
Performance
Electronic devices
Heat -- Transmission
Surfaces (Physics)
Thermal analysis
Surfaces (Technology).
Oke, S.A.
Oyekunle, A.A.
Salau, T.A.O.
Adegbemile, A.A.
Lawal, K.O.
Estimation of thermal contact resistance in metal-plastic interface of semiconducting electronic devices
description Link to publisher's homepage at http://www.unimap.edu.my/ ; Open access only applicable for vol. 1; issue 1, 2008 & vol. 2; issue 1, 2009.
format Article
author Oke, S.A.
Oyekunle, A.A.
Salau, T.A.O.
Adegbemile, A.A.
Lawal, K.O.
author_facet Oke, S.A.
Oyekunle, A.A.
Salau, T.A.O.
Adegbemile, A.A.
Lawal, K.O.
author_sort Oke, S.A.
title Estimation of thermal contact resistance in metal-plastic interface of semiconducting electronic devices
title_short Estimation of thermal contact resistance in metal-plastic interface of semiconducting electronic devices
title_full Estimation of thermal contact resistance in metal-plastic interface of semiconducting electronic devices
title_fullStr Estimation of thermal contact resistance in metal-plastic interface of semiconducting electronic devices
title_full_unstemmed Estimation of thermal contact resistance in metal-plastic interface of semiconducting electronic devices
title_sort estimation of thermal contact resistance in metal-plastic interface of semiconducting electronic devices
publisher Universiti Malaysia Perlis
publishDate 2009
url http://dspace.unimap.edu.my/xmlui/handle/123456789/5340
_version_ 1643788367101427712
score 13.222552

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