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Copper-filled electrically conductive adhesives with enhanced shear strength

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Main Authors: Ho, Li Ngee, Dr., Hiroshi, Nishikawa
Other Authors: lnho@unimap.edu.my
Format: Article
Language:English
Published: ASM International 2015
Subjects:
Conductive adhesive
Copper
Electrical resistivity
Shear strength
Viscosity
Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/39299
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spelling my.unimap-392992017-11-29T06:59:11Z Copper-filled electrically conductive adhesives with enhanced shear strength Ho, Li Ngee, Dr. Hiroshi, Nishikawa lnho@unimap.edu.my nisikawa@jwri.osaka-u.ac.jp Conductive adhesive Copper Electrical resistivity Shear strength Viscosity Link to publisher's homepage at http://www.asminternational.org/ In this study, the effects of diethyl carbitol (diluent) and tertiary amines on the electrical, mechanical, and rheological properties of the Cu-filled polyurethane-based electrically conductive adhesives (ECAs) were investigated. Significant difference could be observed in the electrical resistivity and shear strength of ECA prepared with different amount of diethyl carbitol. Reduced electrical resistivity was found in ECAs prepared with addition of tertiary amines, but no obvious change was observed in the shear strength of the ECA joint. Rheological property of the ECA paste was investigated in order to understand the correlation of the viscosity of ECA paste and electrical resistivity and shear strength of ECA joint. Results revealed that decrease in viscosity of the ECA paste reduced electrical resistivity and enhanced shear strength of ECA joint. A Cu-filled polyurethane-based ECA with considerably low electrical resistivity at the magnitude order range of 10-3 Ωcm, and significantly high shear strength (above 17 MPa) could be achieved. 2015-03-24T04:44:40Z 2015-03-24T04:44:40Z 2014-09 Article Journal of Materials Engineering and Performance, vol. 23(9), 2014, pages 3371-3378 1059-9495 http://dspace.unimap.edu.my:80/xmlui/handle/123456789/39299 http://link.springer.com/article/10.1007%2Fs11665-014-1115-4 en ASM International
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Conductive adhesive
Copper
Electrical resistivity
Shear strength
Viscosity
spellingShingle Conductive adhesive
Copper
Electrical resistivity
Shear strength
Viscosity
Ho, Li Ngee, Dr.
Hiroshi, Nishikawa
Copper-filled electrically conductive adhesives with enhanced shear strength
description Link to publisher's homepage at http://www.asminternational.org/
author2 lnho@unimap.edu.my
author_facet lnho@unimap.edu.my
Ho, Li Ngee, Dr.
Hiroshi, Nishikawa
format Article
author Ho, Li Ngee, Dr.
Hiroshi, Nishikawa
author_sort Ho, Li Ngee, Dr.
title Copper-filled electrically conductive adhesives with enhanced shear strength
title_short Copper-filled electrically conductive adhesives with enhanced shear strength
title_full Copper-filled electrically conductive adhesives with enhanced shear strength
title_fullStr Copper-filled electrically conductive adhesives with enhanced shear strength
title_full_unstemmed Copper-filled electrically conductive adhesives with enhanced shear strength
title_sort copper-filled electrically conductive adhesives with enhanced shear strength
publisher ASM International
publishDate 2015
url http://dspace.unimap.edu.my:80/xmlui/handle/123456789/39299
_version_ 1643802770759745536
score 13.222552

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