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Heat dissipation analysis under natural convection condition on high power LED

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Main Authors: Vairavan, Rajendaran, Zaliman, Sauli, Dr., Retnasamy, Vithyacharan, Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.
Other Authors: rajendaran@gmail.com
Format: Article
Language:English
Published: AENSI Publisher All rights reserved 2014
Subjects:
Aluminum rectangular heat slug
Ansys
Heat slug size variation
Junction temperature
Single chip LED
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/35664
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spelling my.unimap-356642014-06-18T01:53:05Z Heat dissipation analysis under natural convection condition on high power LED Vairavan, Rajendaran Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. rajendaran@gmail.com zaliman@unimap.edu.my vc.sundres@gmail.com vc@unimap.edu.my Aluminum rectangular heat slug Ansys Heat slug size variation Junction temperature Single chip LED Link to publisher's homepage at http://www.aensiweb.com/ As the technology downscales with superior power and increased package density, the thermal effects of the high power LED are significant. Thus, the operating junction temperature of the high power light emitting diodes has to be reduced. In this paper, evaluation on single chip high power light emitting was done. The prime motive of this work was to assess the effect of heat slug size on the junction temperature and stress of LED chip under natural convection condition at ambient temperature of 25°C. Two sizes of rectangular heat slug were used. Simulation was carried out using Ansys version 11. Input power of 0.1W and 1W was applied to LED. Simulated results indicated that a larger slug size is favorable for a lower operating junction temperature and stress of the LED chip. 2014-06-18T01:53:05Z 2014-06-18T01:53:05Z 2013-10 Article Advances in Environmental Biology, vol. 7(SPEC. ISSUE 12), 2013, pages 3634-3638 1995-0756 http://www.aensiweb.com/old/aeb_October-special_2013.html http://dspace.unimap.edu.my:80/dspace/handle/123456789/35664 en AENSI Publisher All rights reserved
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Aluminum rectangular heat slug
Ansys
Heat slug size variation
Junction temperature
Single chip LED
spellingShingle Aluminum rectangular heat slug
Ansys
Heat slug size variation
Junction temperature
Single chip LED
Vairavan, Rajendaran
Zaliman, Sauli, Dr.
Retnasamy, Vithyacharan
Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.
Heat dissipation analysis under natural convection condition on high power LED
description Link to publisher's homepage at http://www.aensiweb.com/
author2 rajendaran@gmail.com
author_facet rajendaran@gmail.com
Vairavan, Rajendaran
Zaliman, Sauli, Dr.
Retnasamy, Vithyacharan
Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.
format Article
author Vairavan, Rajendaran
Zaliman, Sauli, Dr.
Retnasamy, Vithyacharan
Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.
author_sort Vairavan, Rajendaran
title Heat dissipation analysis under natural convection condition on high power LED
title_short Heat dissipation analysis under natural convection condition on high power LED
title_full Heat dissipation analysis under natural convection condition on high power LED
title_fullStr Heat dissipation analysis under natural convection condition on high power LED
title_full_unstemmed Heat dissipation analysis under natural convection condition on high power LED
title_sort heat dissipation analysis under natural convection condition on high power led
publisher AENSI Publisher All rights reserved
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/35664
_version_ 1643797868095471616
score 13.222552

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