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High power LED heat dissipation analysis via copper diamond slug

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Main Authors: Vairavan, Rajendaran, Zaliman, Sauli, Dr., Retnasamy, Vithyacharan, Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.
Other Authors: rajendaran@gmail.com
Format: Article
Language:English
Published: AENSI Publisher All rights reserved 2014
Subjects:
Ansys
Cylindrical copper diamond composite heat slug
GaN LED
Junction temperature
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/35663
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spelling my.unimap-356632016-06-12T14:19:10Z High power LED heat dissipation analysis via copper diamond slug Vairavan, Rajendaran Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. rajendaran@gmail.com zaliman@unimap.edu.my vc.sundres@gmail.com vc@unimap.edu.my Ansys Cylindrical copper diamond composite heat slug GaN LED Junction temperature Link to publisher's homepage at http://www.aensiweb.com/ The emergence of high power light emitting diode as a novel electronic based light source is due to its vast advantage in terms of optical efficacy, low power consumption and enhanced life time. However, the performances of the LEDs are dependent on the junction temperature as it is inherited high heat production. Hence, proper evaluation of the junction temperature is very significant. In this paper, the heat dissipation of single chip high power LED attached to copper diamond based cylindrical heat slug was scrutinized through simulation. The heat dissipation was characterized in terms of junction temperature. In addition, the stress of the LED chip is evaluated with varied input power. Ansys version 11 was used for the simulation. The simulated results reveal that at input power of 1 W, the max junction temperature of the LED is 114.69°C. 2014-06-18T01:50:32Z 2014-06-18T01:50:32Z 2013-10 Article Advances in Environmental Biology, vol. 7(SPEC. ISSUE 12), 2013, pages 3628-3633 1995-0756 http://www.aensiweb.com/old/aeb_October-special_2013.html http://dspace.unimap.edu.my:80/dspace/handle/123456789/35663 en AENSI Publisher All rights reserved
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Ansys
Cylindrical copper diamond composite heat slug
GaN LED
Junction temperature
spellingShingle Ansys
Cylindrical copper diamond composite heat slug
GaN LED
Junction temperature
Vairavan, Rajendaran
Zaliman, Sauli, Dr.
Retnasamy, Vithyacharan
Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.
High power LED heat dissipation analysis via copper diamond slug
description Link to publisher's homepage at http://www.aensiweb.com/
author2 rajendaran@gmail.com
author_facet rajendaran@gmail.com
Vairavan, Rajendaran
Zaliman, Sauli, Dr.
Retnasamy, Vithyacharan
Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.
format Article
author Vairavan, Rajendaran
Zaliman, Sauli, Dr.
Retnasamy, Vithyacharan
Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.
author_sort Vairavan, Rajendaran
title High power LED heat dissipation analysis via copper diamond slug
title_short High power LED heat dissipation analysis via copper diamond slug
title_full High power LED heat dissipation analysis via copper diamond slug
title_fullStr High power LED heat dissipation analysis via copper diamond slug
title_full_unstemmed High power LED heat dissipation analysis via copper diamond slug
title_sort high power led heat dissipation analysis via copper diamond slug
publisher AENSI Publisher All rights reserved
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/35663
_version_ 1643797867798724608
score 13.222552

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