LED heat dissipation study using different Cu slug size
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my.unimap-356182014-06-17T09:24:54Z LED heat dissipation study using different Cu slug size Vairavan, Rajendaran Retnasamy, Vithyacharan Zaliman, Sauli, Dr. Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. rajendaran@gmail.com vc.sundres@gmail.com zaliman@unimap.edu.my vc@unimap.edu.my Ansys Copper rectangular heat slug Heat slug size variation Junction temperature Single chip LED Link to publisher's homepage at http://www.aensiweb.com/ High power light emitting diodes (LEDs) have significant contribution in illumination industry due exceptional advantages in terms of low power consumption, superior reliability, prolonged life time and high efficiency. Rapid growth of the LEDs industry has generated a fresh set of thermal challenges which requires immediate attention. This paper presents a simulation work on a single chip high power LED package. This work focuses on the evaluation of the junction temperature and LED chip stress with varied copper rectangular heat slug size under natural convection condition at ambient temperature of 25°C. Ansys version 11 was used for the simulation. The single chip was powered with input power of 0.1 W and 1W respectively. Results exhibited that the heat slug size has significant effect on the junction temperature of the LED. 2014-06-17T09:24:54Z 2014-06-17T09:24:54Z 2013-10 Article Advances in Environmental Biology, vol. 7(SPEC. ISSUE 12), 2013, pages 3672-3676 1995-0756 http://www.aensiweb.com/old/aeb_October-special_2013.html http://dspace.unimap.edu.my:80/dspace/handle/123456789/35618 en AENSI Publisher All rights reserved |
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Ansys Copper rectangular heat slug Heat slug size variation Junction temperature Single chip LED |
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Ansys Copper rectangular heat slug Heat slug size variation Junction temperature Single chip LED Vairavan, Rajendaran Retnasamy, Vithyacharan Zaliman, Sauli, Dr. Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. LED heat dissipation study using different Cu slug size |
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Link to publisher's homepage at http://www.aensiweb.com/ |
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rajendaran@gmail.com |
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rajendaran@gmail.com Vairavan, Rajendaran Retnasamy, Vithyacharan Zaliman, Sauli, Dr. Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. |
format |
Article |
author |
Vairavan, Rajendaran Retnasamy, Vithyacharan Zaliman, Sauli, Dr. Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. |
author_sort |
Vairavan, Rajendaran |
title |
LED heat dissipation study using different Cu slug size |
title_short |
LED heat dissipation study using different Cu slug size |
title_full |
LED heat dissipation study using different Cu slug size |
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LED heat dissipation study using different Cu slug size |
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LED heat dissipation study using different Cu slug size |
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led heat dissipation study using different cu slug size |
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AENSI Publisher All rights reserved |
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2014 |
url |
http://dspace.unimap.edu.my:80/dspace/handle/123456789/35618 |
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1643797865798041600 |
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13.222552 |