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Cylindrical shape slug heat conduction numerical analysis using copper material

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Main Authors: Zaliman, Sauli, Dr., Retnasamy, Vithyacharan, Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr., Vairavan, Rajendaran
Other Authors: zaliman@unimap.edu.my
Format: Article
Language:English
Published: AENSI Publications 2014
Subjects:
Ansys
Cylindrical copper diamond composite heat slug
GaN LED
Junction temperature
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/35525
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spelling my.unimap-355252014-06-16T00:59:04Z Cylindrical shape slug heat conduction numerical analysis using copper material Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. Vairavan, Rajendaran zaliman@unimap.edu.my vc.sundress@gmail.com vc@unimap.edu.my Ansys Cylindrical copper diamond composite heat slug GaN LED Junction temperature Link to publisher's homepage at http://www.aensiweb.com/ High power light emitting diodes have the edge over the conventional lighting system in terms of efficiency, low energy consumption and long operational lifetime. Nevertheless, the heat dissipation issue of the high power LED bottlenecks the fulfilment of the potential possessed by the LED. The heat dissipation of LED is evaluated in terms of junction temperature. In this work, simulation was carried out to evaluate the heat dissipation of a single chip LED attached to a copper based cylindrical heat slug. The junction temperature and the stress of the LED chip were scrutinized under natural convection condition with applied input power of 0.1 W and 1 W. Ansys version 11 was utilized for the simulation. For input power of 1 W, the maximum junction temperature and Von Mises of 117.44°C and 229.21MPa was exhibited by the GaN based chip. 2014-06-16T00:59:04Z 2014-06-16T00:59:04Z 2013-10 Article Advances in Environmental Biology, vol. 7(SPEC. ISSUE 12), 2013, pages 3639-3643 1995-0756 http://www.aensiweb.com/old/aeb_October-special_2013.html http://dspace.unimap.edu.my:80/dspace/handle/123456789/35525 en AENSI Publications
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Ansys
Cylindrical copper diamond composite heat slug
GaN LED
Junction temperature
spellingShingle Ansys
Cylindrical copper diamond composite heat slug
GaN LED
Junction temperature
Zaliman, Sauli, Dr.
Retnasamy, Vithyacharan
Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.
Vairavan, Rajendaran
Cylindrical shape slug heat conduction numerical analysis using copper material
description Link to publisher's homepage at http://www.aensiweb.com/
author2 zaliman@unimap.edu.my
author_facet zaliman@unimap.edu.my
Zaliman, Sauli, Dr.
Retnasamy, Vithyacharan
Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.
Vairavan, Rajendaran
format Article
author Zaliman, Sauli, Dr.
Retnasamy, Vithyacharan
Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.
Vairavan, Rajendaran
author_sort Zaliman, Sauli, Dr.
title Cylindrical shape slug heat conduction numerical analysis using copper material
title_short Cylindrical shape slug heat conduction numerical analysis using copper material
title_full Cylindrical shape slug heat conduction numerical analysis using copper material
title_fullStr Cylindrical shape slug heat conduction numerical analysis using copper material
title_full_unstemmed Cylindrical shape slug heat conduction numerical analysis using copper material
title_sort cylindrical shape slug heat conduction numerical analysis using copper material
publisher AENSI Publications
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/35525
_version_ 1643797793451540480
score 13.211869

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