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The effects of multiple zincation process on Aluminum Bond Pad surface for Electroless Nickel Immersion Gold deposition

Fulltext article is acessible via ASME Online (http://www.asme.org) or connect to A-Z Listing at http://mylib.unimap.edu.my/

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Main Authors: Mohd Khairuddin, Md Arshad, Ibrahim, Ahmad, Azman, Jalar, Ghazali, Omar, Uda, Hashim
Format: Article
Language:English
Published: American Society of Mechanical Engineers (ASME) 2008
Subjects:
Zincation
Electroless nickel immersion gold (ENIG)
Under bump metallurgy (UBM)
Aluminum
Zinc oxide
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/3505
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spelling my.unimap-35052009-08-14T08:45:02Z The effects of multiple zincation process on Aluminum Bond Pad surface for Electroless Nickel Immersion Gold deposition Mohd Khairuddin, Md Arshad Ibrahim, Ahmad Azman, Jalar Ghazali, Omar Uda, Hashim Zincation Electroless nickel immersion gold (ENIG) Under bump metallurgy (UBM) Aluminum Zinc oxide Fulltext article is acessible via ASME Online (http://www.asme.org) or connect to A-Z Listing at http://mylib.unimap.edu.my/ This paper reports the effects of a multiple zincation processon the Al bond pad surface prior to electroless nickel immersion gold deposition. The study of multiple zincation comprises the surface topogtaphy and morphology of the appearance of the Al bond pad. In addition, by comprehension of the effects of the multiple zincation process, the study includes investigating the Al dissolution rate and adhesion strength between eutectic a 37 Pb/63 Sn solder ball and an under bump metallurgy (UBM) interface. Scanning electron microscopy, energy dispersive x-ray, atomic force microscopy, focused ion beam, and an Intellectest STORM series FA 1500 shear tester were used as analytical tools in this study. The results suggest that the first zincation process follow the contour of the initial bond pad. The second zincation produces a slightly better surface appearance with a smooth and fine Zn crystallite. The Zn crystallites become a continuous film with the deposits looking like an island formation after the third zincation. The smooth surface of the third zincation, as an effect of multiple zincation, is later transferred to Ni and Au surfaces. The smooth surface of the UBM leads to a better shear strength with only a minimum Al dissolved. 2008-12-22T03:14:23Z 2008-12-22T03:14:23Z 2006-09 Article Journal of Electronic Packaging, 128, 2006, pages 246-250. http://hdl.handle.net/123456789/3505 www.asme.org http://mylib.unimap.edu.my/ en American Society of Mechanical Engineers (ASME)
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Zincation
Electroless nickel immersion gold (ENIG)
Under bump metallurgy (UBM)
Aluminum
Zinc oxide
spellingShingle Zincation
Electroless nickel immersion gold (ENIG)
Under bump metallurgy (UBM)
Aluminum
Zinc oxide
Mohd Khairuddin, Md Arshad
Ibrahim, Ahmad
Azman, Jalar
Ghazali, Omar
Uda, Hashim
The effects of multiple zincation process on Aluminum Bond Pad surface for Electroless Nickel Immersion Gold deposition
description Fulltext article is acessible via ASME Online (http://www.asme.org) or connect to A-Z Listing at http://mylib.unimap.edu.my/
format Article
author Mohd Khairuddin, Md Arshad
Ibrahim, Ahmad
Azman, Jalar
Ghazali, Omar
Uda, Hashim
author_facet Mohd Khairuddin, Md Arshad
Ibrahim, Ahmad
Azman, Jalar
Ghazali, Omar
Uda, Hashim
author_sort Mohd Khairuddin, Md Arshad
title The effects of multiple zincation process on Aluminum Bond Pad surface for Electroless Nickel Immersion Gold deposition
title_short The effects of multiple zincation process on Aluminum Bond Pad surface for Electroless Nickel Immersion Gold deposition
title_full The effects of multiple zincation process on Aluminum Bond Pad surface for Electroless Nickel Immersion Gold deposition
title_fullStr The effects of multiple zincation process on Aluminum Bond Pad surface for Electroless Nickel Immersion Gold deposition
title_full_unstemmed The effects of multiple zincation process on Aluminum Bond Pad surface for Electroless Nickel Immersion Gold deposition
title_sort effects of multiple zincation process on aluminum bond pad surface for electroless nickel immersion gold deposition
publisher American Society of Mechanical Engineers (ASME)
publishDate 2008
url http://dspace.unimap.edu.my/xmlui/handle/123456789/3505
_version_ 1643787623181844480
score 13.222552

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