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Characterization of parasitic residual deposition on passivation layer in electronics nickel immersion gold process

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Main Authors: Mohd Khairuddin, Md Arshad, Azman, Jalar, Ibrahim, Ahmad
Format: Article
Language:English
Published: Elsevier Science 2008
Subjects:
Electroless nickel immersion gold (ENIG)
Electroless plating
Metal coating
Parasitic deposition
Electroless deposition
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/3503
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spelling my.unimap-35032010-11-24T06:18:46Z Characterization of parasitic residual deposition on passivation layer in electronics nickel immersion gold process Mohd Khairuddin, Md Arshad Azman, Jalar Ibrahim, Ahmad Electroless nickel immersion gold (ENIG) Electroless plating Metal coating Parasitic deposition Electroless deposition Link to publisher's homepage at www.elsevier.com/locate/microrel 2008-12-22T03:09:16Z 2008-12-22T03:09:16Z 2007 Article Microelectronics Reliability, vol.47, 2007, pages 1120-11126. http://www.sciencedirect.com/science?_ob=ArticleURL&_udi=B6V47-4M1D0KK-1&_user=1659113&_coverDate=07%2F31%2F2007&_rdoc=1&_fmt=high&_orig=search&_origin=search&_sort=d&_docanchor=&view=c&_searchStrId=1553672756&_rerunOrigin=google&_acct=C000054070&_version=1&_urlVersion=0&_userid=1659113&md5=1fb77f161a6870e88296f8e356e66bb0&searchtype=a http://www.elsevier.com/ http://hdl.handle.net/123456789/3503 en Elsevier Science
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Electroless nickel immersion gold (ENIG)
Electroless plating
Metal coating
Parasitic deposition
Electroless deposition
spellingShingle Electroless nickel immersion gold (ENIG)
Electroless plating
Metal coating
Parasitic deposition
Electroless deposition
Mohd Khairuddin, Md Arshad
Azman, Jalar
Ibrahim, Ahmad
Characterization of parasitic residual deposition on passivation layer in electronics nickel immersion gold process
description Link to publisher's homepage at www.elsevier.com/locate/microrel
format Article
author Mohd Khairuddin, Md Arshad
Azman, Jalar
Ibrahim, Ahmad
author_facet Mohd Khairuddin, Md Arshad
Azman, Jalar
Ibrahim, Ahmad
author_sort Mohd Khairuddin, Md Arshad
title Characterization of parasitic residual deposition on passivation layer in electronics nickel immersion gold process
title_short Characterization of parasitic residual deposition on passivation layer in electronics nickel immersion gold process
title_full Characterization of parasitic residual deposition on passivation layer in electronics nickel immersion gold process
title_fullStr Characterization of parasitic residual deposition on passivation layer in electronics nickel immersion gold process
title_full_unstemmed Characterization of parasitic residual deposition on passivation layer in electronics nickel immersion gold process
title_sort characterization of parasitic residual deposition on passivation layer in electronics nickel immersion gold process
publisher Elsevier Science
publishDate 2008
url http://dspace.unimap.edu.my/xmlui/handle/123456789/3503
_version_ 1643787622883000320
score 13.222552

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