Description: Effect of aging temperature on the intermetallic compound (IMC) formation of Sn-0.7Cu/Si3N4 composite solder

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Bibliographic Details
Main Authors:	Mohd Arif Anuar, Mohd Salleh, Noraniza, Saud, S.I. Najib
Other Authors:	arifanuar@unimap.edu.my
Format:	Article
Language:	English
Published:	Trans Tech Publications 2014
Subjects:	Aging Composite Intermetallic
Online Access:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/34873
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