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Effects of Recycled-Aluminium additions on the mechanical properties of Sn-0.7Cu/Cu-Substrate lead-free solder joints

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Main Authors: Mohd Arif Anuar, Mohd Salleh, Somidin, Flora, Mohd Mustafa Al Bakri, Abdullah, Nik Noriman, Zulkepli, Mayappan, Ramani, Noor Farhani, Mohd Alui
Other Authors: arifanuar@unimap.edu.my
Format: Article
Language:English
Published: Trans Tech Publications 2014
Subjects:
Hardness
Lead-free composite solder
Recycled-Aluminium
Shear stress
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/34838
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spelling my.unimap-348382014-05-29T01:54:51Z Effects of Recycled-Aluminium additions on the mechanical properties of Sn-0.7Cu/Cu-Substrate lead-free solder joints Mohd Arif Anuar, Mohd Salleh Somidin, Flora Mohd Mustafa Al Bakri, Abdullah Nik Noriman, Zulkepli Mayappan, Ramani Noor Farhani, Mohd Alui arifanuar@unimap.edu.my niknoriman@unimap.edu.my ramani@perlis.uitm.edu.my Hardness Lead-free composite solder Recycled-Aluminium Shear stress Link to publisher's homepage at http://www.ttp.net/ Varying amount of recycled-Aluminium (0, 3.0, 3.5 and 4.0 wt.% re-Al) particulates produced from aluminium beverage cans were successfully reincorporated into Sn-0.7Cu base matrix solder material via powder metallurgy technique. This paper focuses on the mechanical properties aspect of the new solder when joint on Cu-substrate. The hardness of the composite solders sintered bulks was enhanced with the increasing re-Al additions. Moreover, the composite solders have shown enhancement of shear stress strength at the solder joints. Fracture surface of the failure samples were analyzed using scanning electron microscope (SEM) which have indicated all samples failed under ductile fracture mechanism. However, with the refining dimples formation shown on the fractograph, this report suggests the increasing re-Al reinforcement has optimized the solder joints ductility strength. 2014-05-28T09:18:49Z 2014-05-28T09:18:49Z 2013 Article Advanced Materials Research, vol.795, 2013, pages 795.446 1662-8985 http://www.scientific.net/AMR.795.446 http://dspace.unimap.edu.my:80/dspace/handle/123456789/34838 10.4028/www.scientific.net/AMR.795.446 en Trans Tech Publications
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Hardness
Lead-free composite solder
Recycled-Aluminium
Shear stress
spellingShingle Hardness
Lead-free composite solder
Recycled-Aluminium
Shear stress
Mohd Arif Anuar, Mohd Salleh
Somidin, Flora
Mohd Mustafa Al Bakri, Abdullah
Nik Noriman, Zulkepli
Mayappan, Ramani
Noor Farhani, Mohd Alui
Effects of Recycled-Aluminium additions on the mechanical properties of Sn-0.7Cu/Cu-Substrate lead-free solder joints
description Link to publisher's homepage at http://www.ttp.net/
author2 arifanuar@unimap.edu.my
author_facet arifanuar@unimap.edu.my
Mohd Arif Anuar, Mohd Salleh
Somidin, Flora
Mohd Mustafa Al Bakri, Abdullah
Nik Noriman, Zulkepli
Mayappan, Ramani
Noor Farhani, Mohd Alui
format Article
author Mohd Arif Anuar, Mohd Salleh
Somidin, Flora
Mohd Mustafa Al Bakri, Abdullah
Nik Noriman, Zulkepli
Mayappan, Ramani
Noor Farhani, Mohd Alui
author_sort Mohd Arif Anuar, Mohd Salleh
title Effects of Recycled-Aluminium additions on the mechanical properties of Sn-0.7Cu/Cu-Substrate lead-free solder joints
title_short Effects of Recycled-Aluminium additions on the mechanical properties of Sn-0.7Cu/Cu-Substrate lead-free solder joints
title_full Effects of Recycled-Aluminium additions on the mechanical properties of Sn-0.7Cu/Cu-Substrate lead-free solder joints
title_fullStr Effects of Recycled-Aluminium additions on the mechanical properties of Sn-0.7Cu/Cu-Substrate lead-free solder joints
title_full_unstemmed Effects of Recycled-Aluminium additions on the mechanical properties of Sn-0.7Cu/Cu-Substrate lead-free solder joints
title_sort effects of recycled-aluminium additions on the mechanical properties of sn-0.7cu/cu-substrate lead-free solder joints
publisher Trans Tech Publications
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/34838
_version_ 1643797614631583744
score 13.222552

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