Development of nano-material (nano-silver) in electronic components application
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my.unimap-342712014-05-06T02:07:02Z Development of nano-material (nano-silver) in electronic components application Mazlan, Mohamed Anizah, Kalam, Dr. Nik Rosli, Abdullah, Dr. Loo, Huck Soo, Prof. Madya Ir. Dr. Mohd Mustafa Al Bakri, Abdullah M. S., Abdul Aziz Khor, C. Y. Mohammad Amizi, Ayob Mohd Sukhairi, Mat Rasat mazlan.m@umk.edu.my anizahkalam@salam.uitm.edu.my loo962@salam.uitm.edu.my mustafa_albakri@unimap.edu.my amizi@umk.edu.my sukhairi@umk.edu.my Epoxy moulding compound FLUENT™ Nano-material Plastic leaded chip carrier (PLCC) Thermal management Link to publisher's homepage at www.aensiweb.com/ This paper presents the development of nano-material in electronic components especially in Plastic Leaded Chip Carrier (PLCC) application. The effect of nano-material in Plastic Leaded Chip Carrier (PLCC)will improve thermal resistance as well thermal performance in electronic application. This research is using three dimensional numerical analysis of heat and fluid flow in computer and3D model of microprocessors is built using GAMBIT and simulated using FLUENT software. The study was made for severalmicroprocessors arranged in line under different types of material, inlet velocities and package (chip) powers. The results are presented in terms of average junction temperature and thermal resistance of each package. The junction temperature is been observed and it was found that the junction temperature of the microprocessors is not exceed 70°C. It also found that the application of nano-material in PLCC play important rolesto control and manage the junction temperature. The strength of CFD software in handling heat transfer problems is proved to be excellent. 2014-05-06T02:07:02Z 2014-05-06T02:07:02Z 2013-10 Article Advances in Environmental Biology, vol. 7(SPEC. ISSUE 12), 2013, pages 3850-3856 1995-0756 http://www.aensiweb.com/aeb_October-special_2013.html http://dspace.unimap.edu.my:80/dspace/handle/123456789/34271 en AENSI Publisher All rights reserved |
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Epoxy moulding compound FLUENT™ Nano-material Plastic leaded chip carrier (PLCC) Thermal management |
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Epoxy moulding compound FLUENT™ Nano-material Plastic leaded chip carrier (PLCC) Thermal management Mazlan, Mohamed Anizah, Kalam, Dr. Nik Rosli, Abdullah, Dr. Loo, Huck Soo, Prof. Madya Ir. Dr. Mohd Mustafa Al Bakri, Abdullah M. S., Abdul Aziz Khor, C. Y. Mohammad Amizi, Ayob Mohd Sukhairi, Mat Rasat Development of nano-material (nano-silver) in electronic components application |
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Link to publisher's homepage at www.aensiweb.com/ |
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mazlan.m@umk.edu.my |
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mazlan.m@umk.edu.my Mazlan, Mohamed Anizah, Kalam, Dr. Nik Rosli, Abdullah, Dr. Loo, Huck Soo, Prof. Madya Ir. Dr. Mohd Mustafa Al Bakri, Abdullah M. S., Abdul Aziz Khor, C. Y. Mohammad Amizi, Ayob Mohd Sukhairi, Mat Rasat |
| format |
Article |
| author |
Mazlan, Mohamed Anizah, Kalam, Dr. Nik Rosli, Abdullah, Dr. Loo, Huck Soo, Prof. Madya Ir. Dr. Mohd Mustafa Al Bakri, Abdullah M. S., Abdul Aziz Khor, C. Y. Mohammad Amizi, Ayob Mohd Sukhairi, Mat Rasat |
| author_sort |
Mazlan, Mohamed |
| title |
Development of nano-material (nano-silver) in electronic components application |
| title_short |
Development of nano-material (nano-silver) in electronic components application |
| title_full |
Development of nano-material (nano-silver) in electronic components application |
| title_fullStr |
Development of nano-material (nano-silver) in electronic components application |
| title_full_unstemmed |
Development of nano-material (nano-silver) in electronic components application |
| title_sort |
development of nano-material (nano-silver) in electronic components application |
| publisher |
AENSI Publisher All rights reserved |
| publishDate |
2014 |
| url |
http://dspace.unimap.edu.my:80/dspace/handle/123456789/34271 |
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1643797444233789440 |
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13.222552 |