A new technique of bone thickness measurement for Pedicle Screw insertion safety purpose
Proceeding of The Annual International Conference of the IEEE Engineering in Medicine and Biology Society 2013 (EMBC 2013) at Osaka, Japan on 3 July 2013 through 7 July 2013.
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| Main Authors: | , |
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| Other Authors: | |
| Format: | Working Paper |
| Language: | English |
| Published: |
Institute of Electrical and Electronics Engineers (IEEE)
2014
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| Subjects: | |
| Online Access: | http://dspace.unimap.edu.my:80/dspace/handle/123456789/34173 |
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