您的评论: Optimization of fins used in electronic packaging

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书目详细资料
Main Authors:	Ong, Kang Eu, Lee, Kor Oon, Seetharamu, Kankanhally N., Ishak, Abdul Azid, Dr., Ghulam, Abdul Quadir, Prof. Dr., Zainal Alimuddin, Zainal Alauddin, Dr., Goh, Teck Joo
其他作者:	leekoroon@yahoo.com
格式:	Article
语言:	English
出版:	Emerald Group Publishing Limited 2014
主题:	Programming and algorithm theory Optimization techniques Electronics industry Heat transfer
在线阅读:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/33924
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