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Flow analysis for flip chip underfilling process using characteristic based split method

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Main Authors: Kulkarni, Venkatesh M., Seetharamu, Kankanhally N., Aswatha Narayana, P. A., Ishak, Abdul Azid, Dr., Ghulam, Abdul Quadir, Prof. Dr.
Other Authors: knseetharamu@hotmail.com
Format: Working Paper
Language:English
Published: IEEE Conference Publications 2014
Subjects:
Characteristic based split (CBS)
Fluid flow equation
Onvection-diffusion equation
Volume of fluid (VoF)
Flip chip devices
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/33885
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spelling my.unimap-338852014-04-21T07:28:48Z Flow analysis for flip chip underfilling process using characteristic based split method Kulkarni, Venkatesh M. Seetharamu, Kankanhally N. Aswatha Narayana, P. A. Ishak, Abdul Azid, Dr. Ghulam, Abdul Quadir, Prof. Dr. knseetharamu@hotmail.com ishak@eng.usm.my gaquadir@unimap.edu.my Characteristic based split (CBS) Fluid flow equation Onvection-diffusion equation Volume of fluid (VoF) Flip chip devices Link to publisher's homepage at http://ieeexplore.ieee.org/ In this paper, an effort has made to analyze and numerically simulate the fluid flow in chip cavity using characteristic based split (CBS) method. Simulation methodology includes a solver for the fluid flow equations coupled with technique to keep track of the flow front. Solver uses general convection-diffusion equations and solves flow equations using CBS method in conjunction with finite element method (FEM). The fluid front tracking is carried out using Volume of Fluid (VOF) technique. The velocity field obtained from CBS scheme is used in pseudo-concentration approach to track the advancement of fluid front. A particular value of the pseudo-concentration variable is chosen to represent the free fluid surface demarcating the mold compound and air regions which can be tracked for each time step. Simulation has been carried out for a particular geometry of a flip- chip package. The results obtained are in good agreement with literature and experimental data. 2014-04-21T07:28:48Z 2014-04-21T07:28:48Z 2004 Working Paper Proceedings of 6th Electronics Packaging Technology Conference, 2004, pages 615-619 0-7803-8821-6 http://dspace.unimap.edu.my:80/dspace/handle/123456789/33885 http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=1396681&tag=1 http://dx.doi.org/10.1109/EPTC.2004.1396681 en IEEE Conference Publications
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Characteristic based split (CBS)
Fluid flow equation
Onvection-diffusion equation
Volume of fluid (VoF)
Flip chip devices
spellingShingle Characteristic based split (CBS)
Fluid flow equation
Onvection-diffusion equation
Volume of fluid (VoF)
Flip chip devices
Kulkarni, Venkatesh M.
Seetharamu, Kankanhally N.
Aswatha Narayana, P. A.
Ishak, Abdul Azid, Dr.
Ghulam, Abdul Quadir, Prof. Dr.
Flow analysis for flip chip underfilling process using characteristic based split method
description Link to publisher's homepage at http://ieeexplore.ieee.org/
author2 knseetharamu@hotmail.com
author_facet knseetharamu@hotmail.com
Kulkarni, Venkatesh M.
Seetharamu, Kankanhally N.
Aswatha Narayana, P. A.
Ishak, Abdul Azid, Dr.
Ghulam, Abdul Quadir, Prof. Dr.
format Working Paper
author Kulkarni, Venkatesh M.
Seetharamu, Kankanhally N.
Aswatha Narayana, P. A.
Ishak, Abdul Azid, Dr.
Ghulam, Abdul Quadir, Prof. Dr.
author_sort Kulkarni, Venkatesh M.
title Flow analysis for flip chip underfilling process using characteristic based split method
title_short Flow analysis for flip chip underfilling process using characteristic based split method
title_full Flow analysis for flip chip underfilling process using characteristic based split method
title_fullStr Flow analysis for flip chip underfilling process using characteristic based split method
title_full_unstemmed Flow analysis for flip chip underfilling process using characteristic based split method
title_sort flow analysis for flip chip underfilling process using characteristic based split method
publisher IEEE Conference Publications
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/33885
_version_ 1643797325976436736
score 13.222552

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