Staff View: Developing a mold technology module for freescale – study on effects of materials (compound properties) and molding process parameters on package moldability for QFP

Developing a mold technology module for freescale – study on effects of materials (compound properties) and molding process parameters on package moldability for QFP

In integrated circuit (IC) Packaging, there are several processes involved. The main processes for leaded package are wafer mount, wafer saw, die attach, wire bonding, molding, plating, singulation, trim and form. Molding (encapsulation process) is one of the key process which is done in order to p...

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Main Author:	Tan Hui Khin
Other Authors:	Mohabattul Zaman S NS Bukhari, Prof. Madya Ir. (Advisor)
Format:	Learning Object
Language:	English
Published:	Universiti Malaysia Perlis 2008
Subjects:	Integrated circuit Materials (Compound properties) Molding (Chemical technology) Molding Molding > Technological innovations Quad Flat Package
Online Access:	http://dspace.unimap.edu.my/xmlui/handle/123456789/3373
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id	my.unimap-3373
record_format	dspace
spelling	my.unimap-33732009-02-20T09:13:33Z Developing a mold technology module for freescale – study on effects of materials (compound properties) and molding process parameters on package moldability for QFP Tan Hui Khin Mohabattul Zaman S NS Bukhari, Prof. Madya Ir. (Advisor) Integrated circuit Materials (Compound properties) Molding (Chemical technology) Molding Molding -- Technological innovations Quad Flat Package In integrated circuit (IC) Packaging, there are several processes involved. The main processes for leaded package are wafer mount, wafer saw, die attach, wire bonding, molding, plating, singulation, trim and form. Molding (encapsulation process) is one of the key process which is done in order to protect an electronic device from moisture, ion contamination, radiation, interference, and harsh environment. This means the package provides protection for the IC and defines the shape of the outer surface of the package. By applying pressure, the heated molten molding compound (EMC) is transferred from a plunger, through the runners, and into the mold cavities. There are many variables in terms of materials (EMC), equipments and tooling, and process parameters that should be controlled and improved in order to get a reliable and moldable product. In this research, the Side Gate Molding (SGM) technique was used for molding the 20mm x 20mm LQFP 144 Lead. This study is divided into two parts which are: (i). EMC Study; (ii). SGM Parameters Study. For the EMC study, the moldability of Green and Non-Green EMC are studied and compared to determined which type of EMC show a better moldability performance. From the result, it showed that both green and non-green EMC had an acceptable moldability performance. However, green EMC is more preferable in electronic packaging industry due to the safety consideration and better moldability in wire sweep issue. However, for SGM parameters study, a Design of Experiment (DOE) was conducted to generate the parameters range for better moldability which depends on which defects are more favorable to eliminate or reduce from a process parameters windowing. 2008-11-28T01:19:48Z 2008-11-28T01:19:48Z 2008-05 Learning Object http://hdl.handle.net/123456789/3373 en Universiti Malaysia Perlis School of Materials Engineering
institution	Universiti Malaysia Perlis
building	UniMAP Library
collection	Institutional Repository
continent	Asia
country	Malaysia
content_provider	Universiti Malaysia Perlis
content_source	UniMAP Library Digital Repository
url_provider	http://dspace.unimap.edu.my/
language	English
topic	Integrated circuit Materials (Compound properties) Molding (Chemical technology) Molding Molding -- Technological innovations Quad Flat Package
spellingShingle	Integrated circuit Materials (Compound properties) Molding (Chemical technology) Molding Molding -- Technological innovations Quad Flat Package Tan Hui Khin Developing a mold technology module for freescale – study on effects of materials (compound properties) and molding process parameters on package moldability for QFP
description	In integrated circuit (IC) Packaging, there are several processes involved. The main processes for leaded package are wafer mount, wafer saw, die attach, wire bonding, molding, plating, singulation, trim and form. Molding (encapsulation process) is one of the key process which is done in order to protect an electronic device from moisture, ion contamination, radiation, interference, and harsh environment. This means the package provides protection for the IC and defines the shape of the outer surface of the package. By applying pressure, the heated molten molding compound (EMC) is transferred from a plunger, through the runners, and into the mold cavities. There are many variables in terms of materials (EMC), equipments and tooling, and process parameters that should be controlled and improved in order to get a reliable and moldable product. In this research, the Side Gate Molding (SGM) technique was used for molding the 20mm x 20mm LQFP 144 Lead. This study is divided into two parts which are: (i). EMC Study; (ii). SGM Parameters Study. For the EMC study, the moldability of Green and Non-Green EMC are studied and compared to determined which type of EMC show a better moldability performance. From the result, it showed that both green and non-green EMC had an acceptable moldability performance. However, green EMC is more preferable in electronic packaging industry due to the safety consideration and better moldability in wire sweep issue. However, for SGM parameters study, a Design of Experiment (DOE) was conducted to generate the parameters range for better moldability which depends on which defects are more favorable to eliminate or reduce from a process parameters windowing.
author2	Mohabattul Zaman S NS Bukhari, Prof. Madya Ir. (Advisor)
author_facet	Mohabattul Zaman S NS Bukhari, Prof. Madya Ir. (Advisor) Tan Hui Khin
format	Learning Object
author	Tan Hui Khin
author_sort	Tan Hui Khin
title	Developing a mold technology module for freescale – study on effects of materials (compound properties) and molding process parameters on package moldability for QFP
title_short	Developing a mold technology module for freescale – study on effects of materials (compound properties) and molding process parameters on package moldability for QFP
title_full	Developing a mold technology module for freescale – study on effects of materials (compound properties) and molding process parameters on package moldability for QFP
title_fullStr	Developing a mold technology module for freescale – study on effects of materials (compound properties) and molding process parameters on package moldability for QFP
title_full_unstemmed	Developing a mold technology module for freescale – study on effects of materials (compound properties) and molding process parameters on package moldability for QFP
title_sort	developing a mold technology module for freescale – study on effects of materials (compound properties) and molding process parameters on package moldability for qfp
publisher	Universiti Malaysia Perlis
publishDate	2008
url	http://dspace.unimap.edu.my/xmlui/handle/123456789/3373
_version_	1643787819575934976
score	13.222552

Developing a mold technology module for freescale – study on effects of materials (compound properties) and molding process parameters on package moldability for QFP

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