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Mixing optimization of Sn-Cu-Si₃N₄ via powder metallurgy route for composite solder fabrication

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Main Authors: Muhammad Hafiz, Zan Hazizi, Mohd Arif Anuar, Mohd Salleh, Zainal Arifin, Ahmad, Prof.
Other Authors: hafizhazizi@unimap.edu.my
Format: Article
Language:English
Published: Trans Tech Publications 2014
Subjects:
Composite
Lead-free solder
Powder metallurgy
Silicon nitride
Sn-0.7Cu
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/33605
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spelling my.unimap-336052014-04-11T07:21:45Z Mixing optimization of Sn-Cu-Si₃N₄ via powder metallurgy route for composite solder fabrication Muhammad Hafiz, Zan Hazizi Mohd Arif Anuar, Mohd Salleh Zainal Arifin, Ahmad, Prof. hafizhazizi@unimap.edu.my arifanuar@unimap.edu.my Composite Lead-free solder Powder metallurgy Silicon nitride Sn-0.7Cu Link to publisher's homepage at http://www.ttp.net/ The aim of this study was to optimize the mixing process of a composite solder fabricated via powder metallurgy route, before details study were conducted in the next stage. Powder of Sn, Cu and Si₃N₄ were carefully weighted, mixed and blended in a mechanical alloying machine. The speed of rotation for the jar was kept constant while the time of mixing was varied. Si₃N₄ were added to the Sn-0.7Cu solder as reinforcement. Upon completion of mixing process, the mixed powders were later compacted into a thin disc. The compacted samples were then sintered in a horizontal tube furnace. Microstructural examinations by using SEM were conducted in order to analyze the distribution of Cu and Si₃N₄ particles. With the assistance of ImageJ software, average particle distributions were calculated. Results showed that the best particle distributions were achieved when the mixed powder were blended for 6 hours. 2014-04-11T07:20:04Z 2014-04-11T07:20:04Z 2014 Article Key Engineering Materials, vol.594-595, 2014, pages 765-769 1662-9795 http://dspace.unimap.edu.my:80/dspace/handle/123456789/33605 http://www.scientific.net/KEM.594-595.765 10.4028/www.scientific.net/KEM.594-595.765 en Trans Tech Publications
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Composite
Lead-free solder
Powder metallurgy
Silicon nitride
Sn-0.7Cu
spellingShingle Composite
Lead-free solder
Powder metallurgy
Silicon nitride
Sn-0.7Cu
Muhammad Hafiz, Zan Hazizi
Mohd Arif Anuar, Mohd Salleh
Zainal Arifin, Ahmad, Prof.
Mixing optimization of Sn-Cu-Si₃N₄ via powder metallurgy route for composite solder fabrication
description Link to publisher's homepage at http://www.ttp.net/
author2 hafizhazizi@unimap.edu.my
author_facet hafizhazizi@unimap.edu.my
Muhammad Hafiz, Zan Hazizi
Mohd Arif Anuar, Mohd Salleh
Zainal Arifin, Ahmad, Prof.
format Article
author Muhammad Hafiz, Zan Hazizi
Mohd Arif Anuar, Mohd Salleh
Zainal Arifin, Ahmad, Prof.
author_sort Muhammad Hafiz, Zan Hazizi
title Mixing optimization of Sn-Cu-Si₃N₄ via powder metallurgy route for composite solder fabrication
title_short Mixing optimization of Sn-Cu-Si₃N₄ via powder metallurgy route for composite solder fabrication
title_full Mixing optimization of Sn-Cu-Si₃N₄ via powder metallurgy route for composite solder fabrication
title_fullStr Mixing optimization of Sn-Cu-Si₃N₄ via powder metallurgy route for composite solder fabrication
title_full_unstemmed Mixing optimization of Sn-Cu-Si₃N₄ via powder metallurgy route for composite solder fabrication
title_sort mixing optimization of sn-cu-si₃n₄ via powder metallurgy route for composite solder fabrication
publisher Trans Tech Publications
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/33605
_version_ 1643797226403659776
score 13.222552

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