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Thin film thickness and uniformity measurement for lab-on-chip based nanoelectrode biosensor development

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Main Authors: Balakrishnan, Sharma Rao, Uda Hashim, Prof. Dr., Tijjani Adam, Shuwa
Other Authors: bala.sharmarao@gmail.com
Format: Article
Language:English
Published: Trans Tech Publications 2014
Subjects:
Filmetrics Spectrometer
LPCVD
Oxidation
Spectral reflectance
Thin film
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/33530
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spelling my.unimap-335302014-04-08T07:13:21Z Thin film thickness and uniformity measurement for lab-on-chip based nanoelectrode biosensor development Balakrishnan, Sharma Rao Uda Hashim, Prof. Dr. Tijjani Adam, Shuwa bala.sharmarao@gmail.com uda@unimap.edu.my tijjaniadam@yahoo.com Filmetrics Spectrometer LPCVD Oxidation Spectral reflectance Thin film Link to publisher's homepage at http://www.ttp.net/ One of the advantages of silicon substrate over other semiconductor substrate is the high temperature process capability of the silicon. In this work, silicon wafer is used for thermal processing which involves many high temperature processes such as oxidation and deposition. Thin films on the wafer surface are investigated for its thickness and uniformity. Silicon dioxide (SiO₂) is initially grown using wet oxidation method and characterized for its thickness using FilmetricsSpectrometer. The thickness of SiO₂ achieved is less than 300nm. Silicon Nitride (Si₃N₄) is then deposited by sputter method and its thickness is measured at 210 nm. For the electrode, polysilicon (PolySi) is deposited using Low Pressure Chemical Vapor Deposition (LPCVD) process. Silane (SiH₄) is used as the source forPolySi deposition and the thickness is measured at 160nm. Standard deviation is calculated based on the layer thickness and the uniformity is checked across 5 points on the wafer. Hence, it is very important to have a uniform layer across the wafer surface for a defect free device and at the same time it protects the sensitivity of the sensor. 2014-04-08T07:13:21Z 2014-04-08T07:13:21Z 2014 Article Advanced Materials Research, vol.832, 2014, pages 95-100 1662-8985 http://dspace.unimap.edu.my:80/dspace/handle/123456789/33530 http://www.scientific.net/AMR.832.95 10.4028/www.scientific.net/AMR.832.95 en Trans Tech Publications
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Filmetrics Spectrometer
LPCVD
Oxidation
Spectral reflectance
Thin film
spellingShingle Filmetrics Spectrometer
LPCVD
Oxidation
Spectral reflectance
Thin film
Balakrishnan, Sharma Rao
Uda Hashim, Prof. Dr.
Tijjani Adam, Shuwa
Thin film thickness and uniformity measurement for lab-on-chip based nanoelectrode biosensor development
description Link to publisher's homepage at http://www.ttp.net/
author2 bala.sharmarao@gmail.com
author_facet bala.sharmarao@gmail.com
Balakrishnan, Sharma Rao
Uda Hashim, Prof. Dr.
Tijjani Adam, Shuwa
format Article
author Balakrishnan, Sharma Rao
Uda Hashim, Prof. Dr.
Tijjani Adam, Shuwa
author_sort Balakrishnan, Sharma Rao
title Thin film thickness and uniformity measurement for lab-on-chip based nanoelectrode biosensor development
title_short Thin film thickness and uniformity measurement for lab-on-chip based nanoelectrode biosensor development
title_full Thin film thickness and uniformity measurement for lab-on-chip based nanoelectrode biosensor development
title_fullStr Thin film thickness and uniformity measurement for lab-on-chip based nanoelectrode biosensor development
title_full_unstemmed Thin film thickness and uniformity measurement for lab-on-chip based nanoelectrode biosensor development
title_sort thin film thickness and uniformity measurement for lab-on-chip based nanoelectrode biosensor development
publisher Trans Tech Publications
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/33530
_version_ 1643797202098716672
score 13.222552

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